均溫板標準量測實驗之建立與參數影響之研究

Some important parameters affect the measurement of the vapor chamber

陳哲凱(Chen,Jhe Kai)

指導教授 ： 林唯耕

國立清華大學/原子科學院/工程與系統科學系/碩士(2016年)

摘要

本研究以建立均溫板之標準實驗架設並制定均溫板性能參數之量測方法為目標，以供學界與業界作參考。本文設計包含均溫板性能量測平台與熱擴散率量測平台。均溫板性能量測平台主要以冷凝水套式整體測試機台架構與實驗，使用不同治具，研究其熱阻值之變化。本實驗之冷凝水套有三種，分別為有無流道之冷凝水套(Type A)、有流道之冷凝水套(Type B)與冷凝水套(Type C)，施力治具有兩種，分別為電木支撐塊與鋁板夾具，另有測溫銅塊一個。目前以無測溫銅塊、無電木支撐塊、有流道之冷凝水套、使用鋁製夾具之實驗架設能得到最佳及最小之均溫板熱阻實驗數值，因此可以作為業界之參考。
此外，以Angstrom method理論模型分成一維模式及二維模式分別進行理論分析。實驗方面以定義不同之厚寬比τ之金屬待測物之量測結果，發現厚寬比τ小於0.1之待測物，適用一維理論模式；而對於厚寬比τ大於0.1之待側物，則適合二維理論模式。另外，以四種純金屬待測物量測熱擴散率之實驗結果，與標準值之誤差都在10%以內，而重複性誤差值皆在5%內。

關鍵字

均溫板 ； 熱擴散率 ； 熱阻 ； 厚寬比

並列摘要

This paper presents some of the important parameters while measure the vapor chamber axial thermal resistance. The experiment also included how to improve the accuracy of the axial thermal resistance by using different fixtures in different conditions. Using a water jacket as an example, the laboratory equipment include a water jacket without flow channel (Type A), water jackets with flow channel (Type B、Type C), a copper block with thermal couples, two Bakelite supports and an aluminum clamp. The research shows that the experiment with an aluminum clamp, Type B water jacket without Bakelite support and copper block will get the best performance.
In addition, a thermal diffusivity of vapor chamber measurement device is also developed in experiment. The results indicate that one dimension mode is fit when vapor chamber aspect ratio τ less than 0.1; while two dimension mode is suggested when aspect ratio larger than 0.1. Four pure metals were analyzed in experiment and compare with its standard thermal diffusivity, all the error are within 10%. The repeatability error is less than 5%.

並列關鍵字

Vapor chamber ； Thermal difficivitye ； Thermal resistance ； Aspect ratio

參考文獻

[5] M. Mochizuki, Y. Saito, F. Kiyooka, T. Nguyen, “The way we were and are going on cooling high power processors in the industries, The Seventh International Symposium in Transport Phenomena”, Toyama, Japan, September4-8,2006.

[7] S.-C. Wong K,-C. Hsieh, J.-D. Wu, Wu.-L. Han, “A novel vapor chamber and its performance “,submitted to Int. J. Heat Mass Transfer53(2010)2377-2384.

[9] R. Boukhanouf, A. Haddad, M.T. North, C. Buffone,” Experimental investigation of a flat plate heat pipe performance using IR thermal imaging”, Applied Thermal Engineering 26(2006)2148-2156.

[10] J. Wei, Challenges in cooling design of CPU packages for high-performance servers, Heat Transfer Engineering 29 (2008)178-187.

[11] G.S. Hwang, Y. Nam, E. Fleming, P. Dussinger, Y.S. Ju, M. Kaviany, Multi-artery heat pipe spreader experiment, Int. J. Heat Mass Transfer 53(2010)-2662-2669.