零插入力微型連接器：設計、製作、量測與特性探討

On a Zero-insertion-force Micro-connctor: Design, Fabrication, Measurements, and Characterization

章本華(Ben-Hwa Jang)

指導教授 ： 方維倫

國立清華大學/工學院/奈米工程與微系統研究所/博士(2009年)

https://doi.org/10.6843/NTHU.2009.00117

摘要

本論文將針對創新性零插入力微型連接器的設計、製作與特性量測進行探討。零插入力微型連接器，可解決目前微機電連接器開發所面臨的技術瓶頸，如端子磨耗、高速訊號傳輸之完整性、電磁干擾與缺乏夾持機構設計等相關議題。零插入力微型連接器，除可作為細間距、高速訊號傳輸之連接器應用外，更可將其應用範圍拓展至三維立體封裝、微機電元件測試平台與異質性材料系統構裝等領域。
接觸電阻在連接器應用中扮演著極重要的角色，因此本論文將開發嶄新量測微接觸特性的測試元件，定量化在不同接觸次數下接觸電阻、接觸力與表面粗糙度間關係。由於測試元件具備寄生電阻的校正功能，可增加接觸電阻量測的準確性，因此可萃取出相關的微接觸特性，除此之外，更發展誤差傳遞理論，評估接觸電阻量測誤差對微接觸特性萃取所造成的影響。

關鍵字

微機電連接器 ； 零插入力 ； 出平面幾何形狀控制 ； 微接觸電阻

並列摘要

MEMS-based connectors, manufactured for various applications in industry, are often criticized for problems such as the wearing effect, the poor signal integrity, the EMI prevention for high-speed signal transmission, and the lack of latch design. In this thesis a novel zero-insertion-force (ZIF) micro(μ)-connector and its characterization were presented. The characterization included the design, fabrication, analysis, and quantitative evaluation. The proposed ZIF μ-connector has been shown to remedy these problems. Potential applications of the ZIF μ-connector were addressed.
Contact resistance for MEMS-based devices has been investigated. In particular, a micromachined testing device, designed for the removal of the parasitic resistance, was used to more precisely analyze the relationships among the contact force, the contact resistance, and the contact surface across multiple contact cycles. Error propagation analysis has been conducted to evaluate the accuracy of the measured properties.

並列關鍵字

Micro-electro-mechanical system (MEMS) connector ； Zero-insertion-force (ZIF) ； Out-of-plane shape control ； Micro-contact resistance

參考文獻

[5] N. L. Tracy, R. Rothenberger, C. Copper et al., "Array sockets and connectors using MicroSpringTM technology," Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. pp. 129-140.

[7] D. C. Miller, M. L. Dunn, and V. M. Bright, "Thermally induced change in deformation of multimorph MEMS structures," Proceedings of SPIE - The International Society for Optical Engineering. pp. 32-44.

[8] D. C. Miller, W. Zhang, and V. M. Bright, “Micromachined, flip-chip assembled, actuatable contacts for use in high density interconnection in electronics packaging,” Sensors and Actuators, A: Physical, vol. 89, no. 1-2, pp. 76-87, 2001.

[9] S. Nikles, K. Najafi, R. Bradley et al., "Reliability and contact resistance of polysilicon beam leads for use in a high-density connector," Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). pp. 64-67.

[11] S. Chowdhury, M. Ahmadi, and W. C. Miller, “Microelectromechanical systems and system-on-chip connectivity,” IEEE Circuits and Systems Magazine, vol. 2, no. 2, pp. 4-28, 2002.