在競爭激烈的環境中,一向以自產自銷的DRAM產業而言,也需要不斷地開發新產品並改善產品的品質、降低生產成本以及生產時間來提高其企業的競爭力。以半導體繁複的製造過程而言,在新產品開發初期不應只是重視製造技術的導入,還要注重新產品開發之管理與新產品品質規劃的細節,在產品正式生產前就應消除或探求所有可能發生品質問題的根源,以生產出符合顧客要求的產品。 本案例將透過DRAM產業開發衍生產品CMOS影像感測器為例,藉由專家訪談方式探討品質需求項目後,利用品質機能展開(Quality Function Deployment,QFD)來確立符合顧客需求與技術需求間的關鍵技術需求要項,再經由QFD矩陣找出關鍵技術需求與製程要求之關係,再透過QFD與FMEA(Failure Mode and Effects Analysis,FMEA)的整合,找出顧客期望的關鍵品質及瞭解產品可能引發的失效效應,來探討其可能失效原因以建立預防措施。藉此研究來提出一套新產品開發之品質規劃流程,以減少企業研發成本與產品開發時間,以達到『品質是來自預防,而不是檢驗』的源流管理方式。
In strongly competitive environment, DRAM industry which self sufficiently produces and sells products also needs continuous new product development, cost reduction via quality improvement, and cycle time reduction in order to enhance the competitiveness of enterprise. As semiconductor industry is involved with complicated processes, new product development in the early phase should not only be addressed the introduction and development of technology but also the details of management and quality plan. All possible root causes of quality issues shall be eliminated prior to mass production in order to meet customers’ requirements. This thesis is a case study that, taking CMOS image sensor as example, utilizes Quality Function Deployment (QFD) to establish critical technology requirements that meet customer’s demands and technology demands through expertise survey and interview on quality check items. The relationship between critical technology demands and process demands can therefore be allocated by QFD matrix via the integration of Failure Mode and Effects Analysis (FMEA) so that failure mode analysis can be set up to explore the failure root causes towards prevention. Quality planning process for new product development is accordingly established to reduce corporate’s research and development cost and new product development cycle time to reach the realm of source management - “Quality is embedded in prevention instead of inspection”.