IC影像定位與印字瑕疵檢測之研究

Analysis of IC Image Alignment and Marking Defect Inspection

余准琳(Chun-Lin Yu)

指導教授 ： 林士傑

國立清華大學/工學院/動力機械工程學系/碩士(2006年)

https://doi.org/10.6843/NTHU.2006.00532

摘要

本研究的檢測項目為引腳剪切成型與經過蓋印的DIP IC元件，利用影像處理技術針對在其上的油墨印刷圖案進行檢測的工作。與IC封裝外觀相同，油墨上印刷圖案也扮演著功能辨識的角色，任何人可以憑藉著IC所有外觀進而判斷它的性質與使用性等。就以印字圖案來說，吾人首先針對影像定位介紹許多方法，接著在印字瑕疵檢測部分同樣提出若干種方法進行分析。
影像定位部份，重點在於定位點的決定，可分為近似直線與近似點，近似直線的部分通常以物件的輪廓點當定位點，如IC膠體的邊緣輪廓點近似，近似點通常是計算出一區域的代表點當定位點，如物件的形心或相關係數搜尋匹配最高的點位置等。
印字瑕疵檢測部分，本研究介紹三種檢測方式，且瑕疵種類因不同檢測方式而有所不同，吾人因此根據印字的方式與業界的建議，重新定義IC印字瑕疵種類，並根據這些瑕疵種類發展一套適合的IC印字瑕疵檢測系統，希望能取代人力成為主流。

關鍵字

影像定位 ； 印字檢測

並列摘要

The inspect item of this research is DIP IC components which had formed leads and marked characters, make use of image process to inspect ink patterns printed on it. Same as the IC outline packaging, ink printed pattern gives user to identify the function, we can depend on all of the IC's outline to judging properties and usages etc. Focus on marking patterns, this thesis introduced a lot of image alignment methods, and then other marking defect inspection methods.
Image alignment, emphasis on locations of the alignment point, can be divided to line fitting and point fitting two parts. Line fitting's alignment points usually base on contour of the object, like IC mold's contour line fitting. On the other hand, Point fitting's alignment point is calculated on one area, like centroid of the object, or correlation searching for the highest matching point.
Marking defect inspection, this research bring in three inspect methods , and different defect components have different inspect manners, thus according to marking manners and industry's suggestions to define new IC marking defect components, from that to develop proper IC marking defect inspection system, substitute labor and become a tendency.

並列關鍵字

Image Alignment ； Marking Inspection

參考文獻

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