台灣記憶體封裝業之技術創新與供應鏈關係之探討

A Study of Taiwan Memory IC Assembly Industry’s Technology Innovation and Supply Chain Relationship

張家彰(Chia-Chang Chang)

指導教授 ： 朱詣尹

國立清華大學/工學院/工業工程與工程管理學系/碩士(2007年)

摘要

目前全球前十大的封裝測試廠，將近有一半都是台灣廠商，台灣已然成為全世界封裝測試服務與製造大國。隨著超大型積體電路的演進與發展，IC封裝技術已先後經歷過兩次大的高密度封裝技術變革，在邁入21世紀之際，正蘊釀著第三次重大技術變革，也就是從單晶片的封裝型式發展到多晶片的封裝（MCP, Multiple Chip Package）型式。本研究將從記憶體封裝產業技術創新發展與變革，分析多晶片封裝相關產品的技術創新的性質與類別，建構出創新地圖；另ㄧ方面藉由兩個案例公司，探討在不同的經營模式和供應鏈策略聯盟的模式下，所需不同的技術創新策略。
經由記憶體封裝產品發展軌跡與案例公司分析的結果顯示，就技術創新性質構面來看記憶體封裝多屬於產品創新和製程創新，而就技術創新類別構面而言多屬於獨特性和漸進式。不同記憶體供應鏈中的策略聯盟型式，將關係著技術創新策略的擬訂，以案例A(專屬型)而言，可透過與顧客股權式策略聯盟的優勢，在技術創新層面以滿足顧客需求為主要目的，其次再拓展新的客戶與產品領域；案例B(綜合型)則可以透過綜合型封裝代工的研發經驗與生產經驗，採多元化的產品開發與技術創新，提升競爭力與客戶滿意。本研究在最後章節進ㄧ步分析多晶片封裝市場的需求特性，探討台灣封裝代工廠如何運用半導體產業分工的優勢，從技術創新、封裝代工產業的供應鏈關係等層面，提升記憶體多晶片封裝的市場競爭力。

關鍵字

技術創新 ； 供應鏈關係 ； 記憶體封裝 ； 股權型式策略聯盟

並列摘要

At present nearly the half of the top ten IC assembly and testing manufacturers are located at Taiwan. Taiwan has the major providers of IC assembly and testing service. In order to accommodate IC packaging to the technology migration and development of VLSI two technology evolutions have been successively experienced in IC assembly technology. In the beginning of 21st century, the third technology evolution, which the IC assembly technology is changed from single-chip package to multiple-chip package (MCP).
This research investigates the development and evolution of technology innovation in IC memory package and analyzes the MCP product, which is the typical product of 3rd technology evolution.The research also studies the attributes in innovation and establishes an "innovation map". The study then explores the strategies of technology innovation the case firms needed with different models of strategic alliance in IC memory supply chain.
The result of study reveals that the most of IC memory packages are "Product Innovation" and "Process Innovation" in terms of technology innovation and can be categorized into “Distinctive Innovation” and “Incremental Innovation” by looking into IC memory development trends. The case study shows the different strategic alliance in IC memory supply chain is related with strategy making of technology innovation. In Case A model, the priority of technology innovation is to satisfy customer’s requirement by taking the advantage of equity strategic alliance, and then the secondary is to explore the new customers and products. With regards to Case B model, the technology innovation is recommended adopting the diversiform approach to enhance the competitiveness and customer satisfiaction by utilizing its rich experience in research, development, and production.
At the end, the research further investigates the market requirement of MCP business and studies how Taiwan’s assembly houses utilize their own advantages, such as technology innovation and supply chain relationship, to enhance the competitiveness in MCP market.

並列關鍵字

Technology Innovation ； Supplier Chain Relationship ； Memory IC Assembly ； Equity Strategy Alliance

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