TFT-LCD衝擊之分析與結構改良設計

本研究針對TFT-LCD液晶面板在螺栓與外殼鎖附位置受到半弦波衝擊外力下，探討面板模組中各元件之衝擊動態響應，進而就面板對於衝擊外力有損壞之虞的部分進行改良設計。首先經由簡化假設建立液晶面板模組之模型，由能量法（Lagrange’s equation）推導其運動方程式，了解其簡易模型在半弦波之衝擊外力下之動態特性。再利用有限單元法之專業動態分析軟體ANSYS LS-DYNA進行液晶面板的模型建立，並且依據衝擊實驗對照相同的邊界條件設定與外力輸入以進行運算模擬，藉此了解液晶面板模組在受到各方向衝擊時各元件的動態行為與等效應力分布。　　然而由衝擊實驗與模擬結果可以發現本研究使用之液晶面板模組在受到半弦波衝擊外力時，分布於鋁框與膠框周邊的卡榫有脫離的現象發生。根據其脫離之機制與自由度拘束上的討論，本研究嘗試使用高剛性的材料替代鋁框以及在卡榫上建立另一自由度拘束之擋牆來減少脫離的情形發生。

關鍵字

衝擊試驗；有限單元法

並列摘要

This study is concerned with the dynamic response of TFT-LCD modules that are struck by a half-sine impact acceleration through the bolts connecting with the LCD display module. Then, an improvement is performed by redesigning the parts that may possibly be damaged under the impact. First, we establish a simplified model of the panel structures of the TFT-LCD by several reasonable assumptions, and then develop the dynamic equations by Lagrange’s method for the purpose of understanding the impact dynamic characteristics. We also construct the finite element model of the panel structures of the TFT-LCD by the professional finite element software, ANSYS LS-DYNA, and set the boundary conditions and impact forces in accordance with the impact experiment. By analyzing the results of the impact simulation, we can observe the displacements and distributions of von-Mises stresses of each component of TFT-LCD modules. Comparing the half-sine impacting simulation with experiment, the joints between the frame and bezel around the TFT-LCD panel modules occur to separate. In this study, according to the causes of separation reason and the constraints of the motion degrees of freedom, we employ a material with higher rigidity to replace the original material of the bezel, and design a block on the joint to constrain another degrees of freedom to prevent the joints from separation.

並列關鍵字

TFT-LCD ； LS-DYNA ； impact/shock experiment ； finite element method

參考文獻

[1] E. Suhir, “Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to its Support Contour, with Applied to Printed Circuit Boards, Used in Avionic Packaging,” Inter. J. Solids Structures, vol. 29, no. 1, 1992.

[2] E. Suhir, “Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to its Support Contour,” ASME J. Appl. Mechanics, vol. 5g, no. 1, 1992.

[3] E. Suhir and R. Burke, “Dynamic Response of a Rectangular Plate to a Shock Load, with Application to Portable Electronic Products,” IEEE Trans. Comp. Packag., Manufact. Technol., vol. 17, no. 3, 1994.

[4] Chwee-Teck Lim, Y. M. Teo, and V. P. Shim, “Numerical Simulation of the Drop Impact Response of a Portable Electronic Product,” IEEE Transactions Components and Packaging Technologies, Vol. 25, No. 3, September 2002.

[5] Lim C. T. and Low Y. J., “Investigating the Drop Impact of Portable Electronic Products,” IEEE Electronic Components and Technology Conference, 2002.

國際替代計量

TFT-LCD衝擊之分析與結構改良設計

未授權

主題瀏覽