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  • 學位論文

高加速壽命試驗溫度與震動失效模式檢測分析

HALT Failure Analysis of Thermal and Vibration

指導教授 : 林唯耕
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摘要


在廿一世紀,電子產品透過高科技技術日新月異的發展,不停的追求精緻化,其運用功能更講求多元化,這同時意味著有許多挑戰與技術突破。依據現今相關調查數據顯示電子產品主要的失效問題為溫度散熱不易與震動所導致,因此如何量測產品的極限與能力特性是個很重要的議題。 產品可靠性能力測試有許多方法測量,而最適合的測試設備為高加速壽命試驗系統– HALT (Highly accelerated Life Test),其可測出產品的極限,瞭解設計缺陷改善。HALT主要的檢驗測試應力為溫度與震動,經過各類型之測試分析,可了解其產品之能力範圍。 本研究為將一個市面上常用之組裝系統與主機板進行高加速壽命試驗系統檢驗測試,我們可以得知此組裝系統之正常操作溫度範圍為 -40℃ 至 85℃,其震動可承受至少50Grms;主機板之正常操作溫度範圍 -25℃至45℃,其震動承受最大值為40 Grms。 雖然高加速壽命試驗系統檢驗測試並非為真實的產品壽命測試,但透過測驗結果可以更了解其正常運作環境範圍與使用的耐力極限。在每次的測試階段,將會不斷的檢驗其功能是否能正常執行運作,當遇到失效時,其確認失效問題的主要原因。經過進行修改與恢復後,將會測驗出更多的失效情形,當主要問題大部分都檢測出來,經過改善可增加產品的使用範圍,如此一來可以提升產品的壽命與可靠性。

並列摘要


In twenty-first century, products are getting more and more technical and multifunctional; lots of researchers start to join the team and create new innovation. Meanwhile, when the products become smaller and more powerful, it also means that there are many challenges have to be solved. It is become an important issue about how to acquire products’ property of function operating limitation. According to some experiments and analysis, we can know that the most failure factors of product are the temperature and vibration. In order to make sure the product’s fundamental limit, Highly Accelerated Life Test (HALT) is the best tool to get the information; HALT is a process in which products are subjected to accelerated environments to find weak links in the design and manufacturing process. In this research, we choose two samples for the HALT experiment test, one is a system and another is a motherboard. After the temperature stress, vibration stress, combined thermal and vibration stress, we can claim that the system can work within -30℃ to 75℃, under 50 Grms vibration. And motherboard works within -25℃ to 45℃under 40 Grms. Although HALT isn’t a true life test, using HALT process can determine operation and endurance limit. At each level of applied stress, functional testing is performed on the product sample to evaluate its operation. When a failure occurs, the failure mode and stress level is recorded, and the root cause of the failure is determined. As the failure modes are found and eliminated, limits are pushed further and further out, maximizing margins and increasing the product’s life and reliability.

參考文獻


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被引用紀錄


莊祐誠(2012)。應用於高加速壽命測試之電磁鎚與氣壓鎚的特性比較與其對測試結果之影響研究〔碩士論文,元智大學〕。華藝線上圖書館。https://doi.org/10.6838/YZU.2012.00354
李洋欣(2012)。覆晶球柵陣列構裝元件於不同溫度及振動環境與結合兩者之高加速壽命測試結果比較〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-2801201415003221
曾宇澤(2014)。直流馬達二重反轉軸流風扇的特性測試與分析〔碩士論文,國立臺北科技大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0006-2807201410073200

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