應用於三維積體電路系統中之無線多通道磁性傳輸介面

Multi-Channel Magnetic Transmission Interface for 3D Contactless Connection

顏翊哲(Yen Yi-Che)

指導教授 ： 林崇榮

國立清華大學/電機資訊學院/電子工程研究所/碩士(2015年)

摘要

現今三維積體電路被廣泛的研究，此技術可以突破傳統二維電路的限制，有助提高封裝密度以及較低的操作功率等優勢，其中，直通矽晶穿孔(TSV)成為目前最為主流的技術，不過直通矽晶穿孔製程需要凸塊製程(Bumping)以及受到高深寬比(Aspect Ratio)的限制，導致其面臨高成本、可靠度以及排除區域(KOZ)等問題。
本論文提出一種新的非接觸式多通道磁性傳輸概念，利用一個金屬線圈當作磁場產生器，並以一個磁性穿隧接面(MTJ)當作磁感應器。更進一步，利用MTJ陣列來感應多個金屬線圈的不同磁場分佈，提出了多通道磁性傳輸介面的概念，此概念提供了一種應用於三維積體電路中的高密度無線訊號傳輸的新想法。

關鍵字

三維積體電路 ； 訊號傳輸 ； 三維堆疊 ； 磁性穿隧介面

並列摘要

Currently, 3D integrated circuits have received wide-spread interests and allow the realization of high density, flexible and multi-function hybrid systems. TSV is main stream technology since it gives rise to the high packing density and operates under low power. However, the fabrication process of TSV requires the formation of bumps and high aspect ratio structure, leading to higher cost, reliability and KOZ issues.
In this thesis, a new concept of contactless multi-channel magnetic transmission interface is proposed and demonstarted. This data transmission module uses a micro-coil as magnetic field generator and using a MTJ structure as magnetic field sensor. Further, multi-channel magnetic transmission interface is proposed in this paper by employing MTJ sensor array to detect interaction between multiple coil inputs. This approach provides a possible new direction for high density contactless connection for 3D IC applications.

參考文獻

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