本研究利用TSMC 0.35μm Mixed Signal 2P4M Polycide標準製程平台,結合金屬濕蝕刻的後製程及高分子真空氣相沉積技術,設計與製造出CMOS-MEMS電容式高度感測器作為低壓檢測之應用,並設計其感測壓力為一大氣壓以下和最小感測能力為100Pa之變化,此物理量為一般海平面以上之壓力範圍並希望能運用於高度之檢測。本論文提出(1)高度感測器其參考腔體塗佈上聚對二甲苯薄膜和(2)感測薄膜有較大的預變形使其縮小感測間距,期望提升薄膜之感測能力和解析度,最後歸納出感測元件之性能,以達到高解析度之感測能力。
This study presents CMOS-MEMS capacitive type altimeter with low pressure application. The sensing range is defined below 101.32kPa for detecting low pressure change (about 100Pa). The altimeter containing a reference pressure chamber coated around with parylene-C film and a larger pre-deformation to improve sensitivity and resolution. In application, the altimeter have been designed and implemented by using TSMC 0.35mm 2P4M CMOS fabrication process, and easy post-CMOS process.