以微拉曼探討表面奈米結構熱應力下降現象

Micro-Raman Investigation of Thermal-Stress Reduction by Surface Nanostructures

徐子偉(Tzu-Wei Hsu)

指導教授 ： 葉哲良

國立清華大學/工學院/奈米工程與微系統研究所/碩士(2013年)

摘要

本論文成功利用濕式蝕刻法搭配奈米銀粒子催化反應(Silver-Nanoparticles-Catalyzed Chemical Reaction Wet-Etching)，於一般商品化之4吋單面拋光(100)面之矽晶圓，製作具有規律性且相同深度為1、2、3微米(μm)深度之表面大尺度圖案化奈米垂直線狀結構(Surface Large-Scale Patterned Nanowires)，並成功運用其結構，強化20微米(μm)寬度、300奈米(nm)厚度、配合濺鍍機(Sputter)製作之撥離製程(Lift-Off Process)表面鋁金屬熱電阻線環繞於奈米垂直線狀結構內，且藉由微拉曼光譜儀(Micro-Raman Spectroscopy)，直接證明其微米鋁熱電阻線於通入高電流之高功率情況下，其熱應力之分佈可被週遭環繞表面奈米線狀結構造成熱應力下降之現象，藉此可望提高熱電阻線之可靠度。

關鍵字：金屬催化濕式蝕刻法、拉曼光譜儀、熱應力下降

關鍵字

金屬催化濕式蝕刻法 ； 拉曼光譜儀 ； 熱應力下降

並列摘要

In this study we successfully to demonstrate the silver-nanoparticles-catalyzed chemical reaction wet-etching for commercialize, single-side polished, orientation with (100) face, and 4-inch with diameter silicon wafers with regular and around 1、2、3-μm uniform depth surface large-scale patterned nanowires surrounding the Al-metal heating resistor with 20 μm width and 300 nm thickness by the sputter and lift-off process. After that by the investigation of micro-Raman spectroscopy we directly proved the reduction of thermal stress near the sidewall area between substrate silicon and heating resistor which operating with high power density. By the result of this study we may prove the high density surface nanostructure can enhance the reliability of electronic devices.

Keywords：Metal-Catalyzed Wet-Etching、Raman Spectroscopy、Thermal Stress Reduction

並列關鍵字

Metal-Catalyzed Wet-Etching ； Raman Spectroscopy ； Thermal Stress Reduction

參考文獻

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