以平台為基礎的三維積體電路設計方法與其H.264/AVC影像解碼器實作

A Platform-Based 3D IC Design for H.264/AVC Video Decoding

陳品函(Pin-Han Chen)

指導教授 ： 林永隆

國立清華大學/電機資訊學院/資訊工程學系/碩士(2009年)

https://doi.org/10.6843/NTHU.2009.00796

摘要

相較於傳統的積體電路，三維積體電路提供了許多益處。現今對三維積體電路主要的研究方向多專注於封裝技術及效能取向，較少考量成本。在本篇論文中，我們提出了一個將製造成本及設計複雜度同時列入考慮的平台式三維積體電路設計方法，將其命名為Chipsburger。並且將此方法實作於一個H.264/AVC影像解碼器。根據我們的實驗結果，我們主張這個平台式三維積體電路設計方法不但可減少設計複雜度、增進能源效率、提高效能，更重要的是此設計方法可有效的降低了一次性工程費用及製造成本。

關鍵字

三維積體電路

並列摘要

We propose a platform-based three-dimensional integrated circuit (3D IC) design methodology called Chipsburger. 3D ICs promise many advantages over traditional system-on-a-chip (SoC). Most 3D IC studies address design challenges such as thermal, performance, and floorplanning. Less attention has been paid to cost-driven design. Chipsburger design methodology takes into account both manufacturing cost and design effort. To evaluate our proposed methodology, we implement a H.264/AVC video decoder in Chipsburger 3D IC. Experiments confirm that Chipsburger can reduce non-recurring engineering (NRE) and manufacturing cost, enhance performance, improve energy efficiency, and reduce complexity.

參考文獻

[22]0.13 μm Technology, Taiwan Semiconductor Manufacturing Company, Available: http://www.tsmc.com/english/b_technology/b01_platform/b010102_013um.htm

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