快閃記憶體(Nand Flash),是半導體被歸類為記憶體的一個族群。近年來因為消費者市場對於智慧型手機及平板電腦的大量需求導致其市場急速擴大。為滿足各種型態的記憶體需求,半導體封裝測試廠將面臨時間的壓縮、有限的資源的情況下,被要求製造出高品質及多樣性的產品,以滿足客戶需求及通過客戶的品質認證。六標準差(Six Sigma)是一普遍為大眾所認同有效的改善方法,可用來提升品質並維持企業之競爭力。 本研究是以某半導體封裝測試廠,以改善IC脫層提高顧客滿意度為品質改善目標。該公司透過六標準差方法,運用六標準差步驟,定義、衡量、分析、改善與控制作整體性的改善。其次,本研究也結合品質改善及統計分析手法分析出發生的原因,和可控制的因子,利用田口方法針對控制因子做最佳化的改善。經過驗證及長期監控後,生產中的產品已經完全改善,沒有再發生脫層,並為公司節省了將近五千萬的品質成本 ,也大幅提升了客戶的滿意度。
Nand Flash is regarded as a typical semiconductor memory unit. In recent years, customers’ increasing demands for “Smart phone” and :Tablet computer” give rise to a rapid expansion of the markets.Under such circumstances, along with very limited time and resources, the semiconductor assembly and testing industry still needs to make more products of quality and diversity, and simultaneously, satisfy customers’ needs and meet the qualification requirement. Six Sigma is generally believed to be an effective way to enhance an enterprise’s quality and competitiveness. This research is to investigate a semiconductor assembly and testing house, which improved the IC delamination and succeeded in raising customer satisfaction rating. This company adopted the Six Sigma approach, define, measure, analyze, improve and control to assess the products qualities and make a holistic improvement. Secondly, the research also scrutinizes the factors of quality control with the aid of statistics. It uses Taguchi Methods to control the variables to attain the best result. After being tested and monitored for a long period of time, the occurrence of delamination was prevented. This result saved the company nearly NT50 million dollars and the rating of customer satisfaction is also raised substantially.