摘要
覆晶構裝底部充填技術是利用毛細驅動力將填充材料充填至包含錫球陣列的晶片與基板之間。本研究主要針對平行板間滯性流體流動及毛細驅動力理論來分析底部充填製程，並且建立兩組不同型式的實驗模組（無凸塊模組與含凸塊模組）加以模擬和驗證。由於影響整個充填時間的因素很多，但本研究中只探討對間隙高度、充填材料表面張力、黏度及凸塊密度對充填時間及波前的影響。 為了能夠清晰地觀察實驗及測量波前，因此實驗中利用兩透明玻板取代晶片與基板；由於理論假設流體為層流、不可壓縮、牛頓流體及2D水平流動，所以在實驗上選擇使用合乎上述條件的機油（SAE40）和Silicon Oil (MS 1000)作為實驗的對象，以減少理論值與實驗值的誤差。 本次實驗利用數位相機擷取實際波前影像和經過影像處理軟體Photoshop量測出波鋒值；依照累積相同實驗條件的實驗結果做數值分析成實驗值的最佳參數曲線，讓實驗值具一致性；且將實驗時間代入參數曲線所得的波鋒值帶入理論公式推算出理論時間，再與實驗時間做比對；同時本實驗亦利用CAE軟體（C-MOLD）對實驗做模流分析的模擬與驗證。
並列摘要
The underfill of flip chip packages was encapsulated between chip and substrate by capillary attraction. This study uses the theory of viscous fluid motion and capillary flow to analyze the packaging process of underfill. Besides, two experimental modules, including no bump module and bumps module are used to simulate and verify the theoretical model. This paper will discuss the influences of gap size, bumps density, surface tension, and viscosity. In order to observe the flow behavior and measure flow distance easily, these models were set up with glass plates to replace chip and substrate. According to the assumption of theoretical equations, the fluid is incompressible, laminar, Newtonian and 2D flow. Therefore, this study uses two normal Newtonian fluids, which are oil (SAE 40) and silicon oil (MS 1000). Digital camera was used to catch images and Photoshop software was used to measure flow distance. The numerical method was applied to find the optimal experimental curve. Then, experimental data were substituted into the polynomial to predict the value of flow distance. The theoretical filling time is also obtained by substituting the actual flow distance to the theoretical equation, and then this theoretical value will be compared with experimental time. Finally, C-MOLD software is applied to simulate the underfill process.