摘要
本次研究的對象為FOTON形式的黏晶機，控制部分設計了以分散式控制架構來取代原有黏晶機的邏輯控制器，分別使用可程式控制器(Programmable Logic Controller)、位置控制模組(Motion Control)、及微處理機(Micro Processor)作為實體的控制層，並加入人機介面(Man Machine Interface)做為上層的監控層，來實現完整的控制架構，完成在晶圓處理及晶元取放的控制動作，並經過與實際的機台連線測試，證明此種架構是可行的，並能達到初步黏晶速度的要求。另探討頂針力量控制器的設計，因頂針與晶元接觸時的撞擊力，若設定不當則可能造成晶元的受損，尤其未來薄型晶片的趨勢，晶元將更形脆弱，因此設計了混合位置/力量控制器，來模擬驗證頂針力量控制的可行性，確保晶元頂取過程中的安全性，將可做為未來黏晶機設計的參考依據。
並列摘要
The object of this research is FOTON type Die Bonder machine. The design of control portion is use the distributed control configuration to replace the original logic controller, to accomplish the motion of wafer handling and die access. That use programmable logic controller、motion controller、and 8051 micro processor as the physical control layer, and use man machine interface as the monitor layer. Through physical testing to connect with die bonder, prove the configuration is feasible, and can be reach the throughput requirement of die access speed. Besides, to consider the design of the force control on the needle. If the force of collision between chip and needle do not set correctly will cause the chip damage. Especial the thin chip trending in the future, die will more fragile. For the reason, this thesis applied the algorism “Hybrid position/force control theorem”, and using this architecture for simulation to approve the solution is practicable. The purpose is to protect chip safety on the process, which will be referenced for future die bonder experiment designing.