六氟異亞丙基二苯胺系列之聚醯亞胺及其衍生之聚醯亞胺/二氧化矽混成材料之製備與性質研究

The study of polyimide-silica hybrid derived from the 4,4-hexafluoroisopropylidene dianiline based polyimides

林弘儒(Hung-Ju Lin)

指導教授 ： 鄭俊麟

中原大學/工學院/化學工程研究所/碩士(2005年)

https://doi.org/10.6840/cycu200500363

摘要

本研究是藉由不同的雙酐單體與帶有含氟基團的六氟異亞丙基二苯胺(4,4-hexafluoroisopropylidene dianiline, 簡稱6FDAm)的雙胺來進行氟化聚醯亞胺的製備。此外，為了提升聚醯亞胺的玻離轉換溫度，我們將使用TEOS來進行溶凝膠（sol-gel）反應，以形成具有二氧化矽粒子的有機/無機複合材料。由本研究結果顯示，6FDA-6FDAm在此系列聚醯亞胺其介電常數可低至2.7，顯示導入越多的含氟基團會越降低其介電值。此外，本研究亦顯示掺混二氧化矽粒子可明顯提高聚醯亞胺的玻璃轉化溫度。其中當二氧化矽粒子掺混量30wt%時，其玻璃轉化溫度可由328℃明顯提昇到352℃，而其介電常數值仍可維持在~3.1左右，顯示加入二氧化矽粒子可有效提高材料的玻璃轉化溫度。最後，此系列聚醯亞胺其3%的熱裂解溫度均可維持在480℃之上，楊氏模數在1.2 GPa以上，顯示有不錯的熱性質與機械性質，另外也具有不錯的銅擴散阻障能力，顯示此材料頗具應用在半導體製程之低介電材料的潛力。

關鍵字

TEOS ； 氟化聚醯亞胺 ； 六氟異亞丙基二苯胺

並列摘要

In this study, a series of 4,4-hexafluoroisopropylidene dianiline based polyimides were prepared using three different kinds of dianhydride. In addition, in order to promote the glass transfer temperature of polyimide, we will use the TEOS for Sol-Gel reaction to make the organic/inorganic hybrid materials. Our results are shown that 6FDA-6FDAm of these fluorinated polyimides have the lowest dielectric constant, it will be low for 2.7, this result is shown that more fluorinated groups will reduce dielectric constant substantially, besides our results are also shown that silica hybrid polyimide will promote the glass transfer temperature substantially, it will rise to 352℃（@ 30 wt% silica hybrid）from 328℃,but the dielectric constant still hold in 3.1, this result is shown that added silica particles will rise the glass transfer temperature of 6FDA-6FDAm. Finally, all of 4,4-hexafluoroisopropylidene dianiline based polyimides show good thermal stability (>480℃), good mechanical properties (Young modulus>1.2 GPa), and good diffusion barrier to resist copper penetration, this result is shown that these materials have good opportunity to be used as low-k materials in microelectronic process.

並列關鍵字

TEOS ； 4.4-hexafluoroisopropylidene dianiline ； Fluorinated polyimide

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