V型微流道內毛細填充現象研究

Study on Capillary Filling in V-Grooved Microchannels

林彥吉(Yuan-Ji Lin)

指導教授 ： 趙修武

中原大學/工學院/機械工程研究所/碩士(2005年)

https://doi.org/10.6840/cycu200500572

摘要

微小化係光電、半導體等高科技相關產業的努力目標，隨著近幾年來在微電子及分子生物領域的快速發展，使得在侷限狹小空間內熱與流傳送現象變得日趨重要。微流道則是在生醫晶片、微燃料電池、微電子熱傳等領域皆廣泛應用的一種結構，因此研究在微流道中的流流體傳遞現象將對產業的發展有相當助益。
本文探討在截面形狀為V型微流道內，以表面張力做為驅動力的毛細充填過程。了解以V型微流道內表面張力流的流體輸送和界面現象，本文以實驗量測與計算流體力學方法模擬，並同時提出描述該現象的理論分析模式。實驗結果顯示，在填充過程的前1000μm內，填充速度呈現微小的振盪現象。經由理論分析，數值模擬、實驗量測與文獻研究間的相互比對，最後提出V型微流道內表面張力流毛細填充現象與歐氏數Oh、動態接觸角與無因次化參數fRe有關。

關鍵字

V型微流道 ； fRe值 ； 毛細填充現象

並列摘要

The fast development of MEMS technologies encourages extensive studies on the mass and heat transfer phenomena in micro-systems. The microchannel is a kind of extensively applied structure in the field of microsystems, such as bio-chips, micro-fuel cells and micro-heat sinks etc. Therefore, the study on the microchannel flow is very useful from the industrial point of view.

This paper discusses the capillary filling process in V-grooved microchannels which are driven by the surface tension. In order to understand the interfacial phenomena of capillary filling, experimental measurements and numerical simulation are employed. Additionally, a theorical model describing the capillary filling behavior is derived. The experimental results show that the filling velocity has a small oscillation in the first 1000μm capillary filling length. By Comparison among with the theorical analysis, numerical simulations and experimental measurements, the capillary filling process in the V-grooved microchannels is found to be related to the Ohnesorge number, dynamic contact angle and dimensionless parameter fRe.

並列關鍵字

V-grooved Microchannel ； capillary filling ； fRe

參考文獻

28. 朱健誠，「V型微流道壓降行為之研究」，中原大學機械工程學系碩士學位論文，2003。

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