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  • 學位論文

4,4'-二苯胺基-二乙氧基矽氧烷衍生之聚醯亞胺/二氧化矽混成材料之合成與性質研究

Synthesis and Properties of Polyimide/Silica Hybrids Derived from 4,4’-Diaminophenyl Diethoxysilane

指導教授 : 鄭俊麟
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摘要


本研究利用新合成出之含有矽氧烷側鏈的雙胺單體4,4’-diaminophenyl diethoxysilane (PDSDA),與商業化之雙胺單體4,4-methylenedianiline (MDA)與hexafluoroisopropylidene diphthalic dianhydride (6FDA),分別進行反應以形成聚醯胺酸,然後再添加TEOS,進行溶凝膠(sol-gel process)反應,以製備含有矽氧烷側鏈之聚醯亞胺/二氧化矽混成材料。 由AFM觀察結果得知,藉由添加偶合基團PDSDA,可將SiO2粒子直徑最小控制到5~10 nm左右,而且能均勻分佈在聚醯亞胺膜材內部。 以UV-VIS-NIR光譜檢測,得知加入偶合劑PDSDA的加入有助於相容性的提昇;並且在通訊波長範圍並無顯著的吸收,顯示應用於光學元件有很大的助益。 由TGA及DSC結果顯示,摻合SiO2粒子後之聚醯亞胺,其熱穩定性並無明顯改變。然而TMA量測結果顯示,加入TEOS則會有效降低材料之膨脹係數值。

並列摘要


In this study, a series of novel polyimide-silica composites are successfully synthesized with 4,4’-methylenedianiline (MDA), 4,4’-diaminophenyl diethoxysilane (PDSDA) and hexafluoroisopropylidene diphthalic dianhydride (6FDA) via sol-gel reaction. The morphology, microstructure, particle size and particle distribution of silica in hybrid matrix were analyzed by AFM. The results show that incorporation of coupling agent could make silica size smaller. The smallest size of silica could be attained to be 5~10 nm in this study. Thermal analyses reveal that all of hybrid composites have high thermal stability (3%Td>490℃). In addition, addition of silica can effectively decrease thermal expansion of composite materials. UV-VIS-NIR results show no apparent light absorbance in the range of communication wavelength. Therefore, they could have potential applications in optical devices.

並列關鍵字

polyimide SiO2 sol-gel process

參考文獻


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