晶圓級封裝之無鉛銲錫的溫度循環/熱機械行為

封裝小型化及無鉛化使材料與製程參數面臨很大的衝擊，材料的選擇各有擁護者卻無法統一。在可靠度分析上，以往因電腦設備不足一直使用二維模型進行預測，但這樣會把複雜的問題簡單化，本文針對晶圓級封裝不同維度的模型及各種簡化模型做一事先的討論再進行研究分析；根據分析結果，採用八分之一簡化對稱模型配合有限元素分析軟體模擬及田口方法的使用，利用直交表考慮升溫率、高溫溫度、低溫溫度、高溫恆溫時間及低溫恆溫時間共五個因素，每個因素四個水準，進行潛應變、塑性應變及塑性-潛應變三個實驗；接著，更進一步針對晶圓級封裝錫球之二元及三元無鉛銲料設定四種不同的溫度循環，進行熱機械行為探討。結果顯示不同維度之分析，二維模型的結果會與三維模型差一個值階，因而本文重點會在多種三維模型中選出對可靠度評估最為保守的模型進行一系列的研究與探討：其一，在三組田口實驗中，發現影響錫球應變範圍之最主要因素為溫度範圍；其二，在熱機械行為的分析中，由四種不同溫度負載中也可以整理出溫度範圍是影響變形範圍最為重要的因素，而升溫率對彈-塑-潛應變略有影響，這與田口實驗結果一致。本研究使用文獻所提供無鉛銲料之材料性質，做一連串的分析與探討，主要目的除了想更瞭解無鉛銲料的資訊，也期待結果供給未來訂定溫度循環參數做一參考。

關鍵字

無鉛銲料；田口方法；有限元素分析；溫度循環；晶圓級封裝

並列摘要

The miniaturized and unleaded packages in IC manufacturing made a tremendous impact. Each material of solder joints used to IC packages has various supporters, but it cannot be incorporated and integrated identically at present. The finite element simulation with 2D model is hard to simplify in reliability analysis. First, this study investigates different models with 2D and 3D. In accordance with the result, it adopts one-eighth model to analyze with the finite element software and Taguchi method. The orthogonal array of is utilized to probed the effects and behaviors of strain under five temperature loading parameters of temperature ramp rate, high and low dwell temperature, and dwell temperature time. Furthermore, the study investigates thermal mechanical behavior of the four solder joint materials under four temperature loading. The result shows that 2D model differs from 3D model in one order. This study selects one-eighth model in all kinds of 3D model to estimate the reliability. In the serious study, the temperature range is the main factor to the magnitude of the strain range from the Taguchi experiment. Second, it can be found that the temperature range is the most significant factor on elastic-plastic-creep analysis under four temperature loadings, and the temperature ramp rate affects slightly. This result is the same as the Taguchi experiment. The purpose in serious study is to provide more information of the thermal mechanical behavior of lead-free solder toward the standard parameter of thermal cycling test in the future.

並列關鍵字

WLCSP ； Taguchi method ； The finite analysis ； Lead-free solder ； Temperature cycling

參考文獻

[1] D. Napp, Lead-Free Interconnect Materials for the Electronic Industry, the 27th International SAMPE Technical Conference, P.342

[2] J. H. Lau, W. Dauksher, and J. Smetana, HDPUG’s Design for Lead-Free Solder Joint Reliability of High-Density Packages.

[3] R. Darveaux, and K. Banerji(1991), Fatigue Analysis of Flip Chip Assemblies Using Thermal Stress Simulations and a Coffin-Manson Relation, , 41st Electronic Components and Technology Conference, pp.797-805.

[4] H. Mavoori, and J. Chin(1995), Reliability, Lifetime Prediction and Accelerated Testing of Prospective Alternatives to Lead Based Solders, Electronic Components and Technology Conference, pp.990-998.

[6] Q. Yu, and M. Shiratori(1997), Fatigue Strength Prediction of Microelectronic Solder Joints Under Thermal Cyclic Loading, IEEE Trans. Component and Packaging Manufacturing Technology, Part A, 20(3), pp.226-273.

國際替代計量

晶圓級封裝之無鉛銲錫的溫度循環/熱機械行為

未授權

主題瀏覽