Abstract In this study, a novel modification method on silicon wafer surface was developed. This method shows advantages of simple and easy treatments and chemical versatility. The procedure of this method are incorporation of GPE monomer to silicon wafer surface by ring-opening reaction, chemical functionalization of amino groups on the GPE moieties, and grafting polyamides and polyimides chains onto silicon surfaces. The chemical composition and surface topography of the wafer surface after modification were determined by X-ray photoelectron spectroscopy (XPS) and atom force microscopy (AFM).