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  • 學位論文

應用時域反射法偵測電纜故障或局放點位置

Application of Time Domain Reflectometry Method to Cable Fault and Cable Partial Discharge Source Location

指導教授 : 陳士麟 顏世雄

摘要


在電纜發生故障後,故障點的偵測須快速及準確,以縮短搶修復 電時間。在電纜故障前,已經開始的劣化過程常藉由局部放電檢出電 纜的絕緣劣化,尤其是當距離長、電力系統架構複雜或工作環境較為 特殊,譬如佈置在海底的電纜,則有必要快速檢出局放點位置,以採 取適當的處理措施。 本論文針對局部放電點與故障點進行測距研究。首先,利用 EMTP/ATP Draw電磁暫態程式,建立25kV電纜之局放與故障分析模 型。所稱局放分析模型係模擬電纜絕緣層發生局部放電,觀察局放脈 衝在電纜中的折反射特性;所稱故障分析模型係模擬注入之高頻脈衝 在短路、開路的電纜中之傳導特性。在瞭解其特性後,二者皆運用時 域反射法找尋發生局放之電纜的局放點或找尋發生短路或開路之電 纜的故障點位置。 模擬結果顯示,時域反射法不但適用於電纜局放點定位,亦適 用於電纜的故障點定位。

並列摘要


After cable fault, the detection of fault location should be instant and accurate thus to reduce the time required for power restoration. Before cable fault, the worsened insulation layer is detected through the occurrence of partial discharge (PD) activities. Therefore, the PD sources should particularly be dealt with betimes, when the cable is with long distance, within complex structure of power system, or under such environment as undersea. The locations of PD sources and fault points are investigated in this paper. Here Electro-Magnetic Transient Program (EMTP)/Alternative Transients Program (ATP) are not only used to set up PD analysis model in order to simulate PD activities occurring within insulation layer of 25kV cable, but to set up fault analysis model in order to simulate the short- and open-circuit faults between the conductor and the shielding layers. Then, through the consequence of simulation, the propagation characteristics including the reflection and refraction within the cable, of an input high frequency pulse the short- and open-circuits or of the PD pulse under the occurrence of PD, could be observed. Ultimately, the Time Domain Reflectometry (TDR) Method is applied to locating the PD sources and the fault points. As the result shows, the TDR is feasible for the location both PD sources and fault points.

參考文獻


Power Cable,” IEEE Electrical Insulation Magazine, Volume 24,
2008, pp.25-29.
Medium Voltage Cable Parameters for PD-Detection,” Conference
Proceedings of the 1998 IEEE International Symposium on
Electrical Insulation, Volume 1, 1998, pp.109-112.

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