保護元件在通訊系統之研究和探討

目前通訊科技日新月異，電子業蓬勃發展，產品往輕薄短小發展，數位化更是趨勢，速度的要求也愈來愈快，因此 EMI的問題也越趨嚴重。也因產品體積日趨縮小而攜帶方便，在移動通信系統，無線射頻系統設計，提供最佳解決方案。傳導型 EMI的解決方式通常是加一個電源濾波器在電源端的入口，以抑制雜訊從電源線傳出。因此選擇適合的濾波器是解決傳導型 EMI的關鍵，能夠很快速且有效率的將濾波器設計出來是每一個工程師的目標。其中傳導型 EMI的雜訊分兩個模態，共模和差模訊號，濾波器的設計和雜訊的模態有密切的關係，因此能將雜訊分開將對工程師設計濾波器有很大的幫助，可以縮短設計時間及成本。本文探討了採用低容TVS防止ESD時，最小擊穿電壓和擊穿電流、最大反向漏電流和額定反向切斷電壓等參數對電路的影響及選擇準則，並針對可攜通訊電子設備、以及手機的視訊線路保護、USB保護等介紹了一些典型應用。隨著行動產品、視訊轉換盒(STB)等產品的迅速發展，消費者正要求越來越先進的性能。半導體元件日益趨向小型化、高密度和功能複雜化，特別是像時尚消費電子和通訊可攜式產品等對主板面積要求嚴格的應用很容易受到靜電放電的影響。一些採用了深次微米製程和甚精細線寬佈線的複雜半導體功能電路，對電路瞬變過程的影響感應更強烈，而這都將突顯上述問題。最後，依實際通訊產品應用做說明,也針對影響保護元件因素做可靠度驗證和如何量測EMI做實驗,本論文在下述章節會說明。

關鍵字

保護元件

並列摘要

Current communications technology with each passing day, booming electronics industry, product development to light short, digitization is a trend of increasing demand for speed faster, so the problem of EMI is also getting more and more serious, Also becoming increasingly smaller due to product size and easy to carry, in the mobile communications systems, radio frequency system design, to provide the best solution. EMI conduction type of solution is usually an additional filter in the power supply side of the entrance to curb noise came from the power cord. Therefore choose to solve the conduction-type filter is the key to EMI can be very fast and efficient filter design will come out is the goal of every engineer. EMI conduction type in which the two-mode noise, common-mode signals and differential-mode signal, filter design and modal noise are closely related, so engineers will be able to separate the design of noise filters have very great help, you can shorten the design time and cost. This paper discusses the use of low capacity TVS to prevent ESD, the minimum breakdown voltage and breakdown current, the maximum reverse leakage current and rated voltage, such as cutting back on the circuit parameters and selection criteria, and the portability of communications for electronic equipment, as well as video phone line protection, USB protection, introduced a number of typical application. With mobile products, set-top box (STB), such as the rapid development of products, consumers are demanding more and more advanced features. Semiconductor components of the growing trend of small-scale, high-density and functional complexity, especially as fashion portable consumer electronics and communications products, such as demanding on the main board of the application area is highly susceptible to the effects of electrostatic discharge. Some use of deep sub-micron manufacturing process and a very fine line width semiconductor features the complexity of wiring circuit, circuit transient process of induction is stronger, which will highlight the issue. Finally, according to the actual application of communications products that also protect the components against the effects of factors and how to verify the reliability of EMI measurement experiments, This paper will describe in the following sections.

並列關鍵字

protection components

參考文獻

[2] .Mark J. Nave, “A Novel Differential Mode Rejection Network for Conducted Emissions Diagnostics,” Proceedings of IEEE EMC., Denver, Co., 1989.

[3]. Ting Gou, Dan Y. Chen, and Fred C. Lee, “Separation of the Common-Mode- and Differential-Mode-Conducted EMI Noise, ”IEEE Trans. Power Electronics, Vol. 11, NO. 3, May 1996.

[4] .C.R. Paul and K.B. Hardin, Diagnosis and reduction of conducted noise emissions, IEEE trans. On Electromagnetic Compatibility, EMC-30, 553-560(1988)

[7] .Fu-Yan Shih, Dan Y. Chen, Yan-Pei Wu, and Yie-Tone Chen, ”A Procedure for Designing EMI Filters for AC Line Applications ”, IEEE Trans. on Power Electrons, Vol. 11, NO.1, Jan. 1996.

[8]. Raul G. Munoz, Tai-Wu Hao, ”Simulation of Response of Modeled EMI Filter to Measured or Simulated Time Domain Waveforms ”, IEEE International Symposium on , 1995.

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保護元件在通訊系統之研究和探討

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