中文摘要 近年來,電機、電子、資訊、通訊等產品普及率不斷提高,各種數位運用新科技不斷推陳出新之下,使得IC多層載板製程技術演進相當快速。產品不但要求輕薄短小外還需配合系統晶片功能多元化,使得與系統晶片在整合實現時,對IC多層載板的品質要求更為嚴苛,因此生產設備妥善率更顯其重要性與時效性。 本文將針對IC多層載板製程中,因電力系統供應問題對於該產業精密線路檢測設備之影響,藉由頻譜分析、電磁場分析等儀器實際量測干擾現象,經由量測與分析得知問題點,進而採取預防措施與效果確認,以改善該製程中生產的產能與產品之可靠度。 由於在IC多層載板製程中,包含大量非線性負載,如轉換器、變頻和整流器等電力電子負載。將對電力系統供應造成污染,直接影響該產業之精密檢測設備能力,因此電力供應品質對於高科技產業精密工廠的生產有著極大的影響,電力系統供應品質已是不容忽視的課題。
Abstract In recent years, electrical, electronics, information and communications products increased in popularity. Various digital use of new technologies continued to emerge under, makes multilayer IC substrate process technology evolution very quickly. Products not only to its lightweight system outside the chip with various features and functions needed to make the chip and system integration is achieved, on the multilayer IC Substrate more stringent quqlity requirements. Therefore, the rate of production is even more the importance of proper equipment, and timeliness. This article will focus on IC process in the multi-carrier board, power system due to supply problems for the industry, the effect of precision testing equipment line. By spectrum analysis, electromagnetic analysis, the actual measurement equipment interference, through the issue of measurement and analysis that point, and then take preventive measures and results confirmed that in order to improve the process of production capacity and product reliability. The multilayer IC Substrate process contains large of nonlinear loads, such as converter, inverter and rectifier and other power electronic load. The supply of electric power system will cause pollution. Directly affect the precision test equipment industry capacity. So the quality of power supply plant for the production of precision high-tech industry has a great impact. The supply of quality power system has been the subject can not be ignored.