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  • 學位論文

酸性溶液一次性蝕刻銅薄膜和氧化銦錫薄膜特性研究

The study of copper and indium tin oxide in one step acid solution etching

指導教授 : 籃山明
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摘要


摘要 由2009年開始,觸控面板發展開始邁入新的應用產品領域,從智慧型手機、平板電腦到筆記型電腦,每種產品都越來愈熱賣,帶動2010年觸控面板市場值上升40%以上,其中投射式觸控面板,更是主要的推廣產品。但是投射式電容觸控面板的製程步驟繁瑣,製程時間和成本居高不下,良率不高,所以製程上的改善和進化成為重要的課題。其最主要的製程乃屬黃光製程,也就是微影製程。 蝕刻製程是目前科技產業之中,不論是顯示器產業、太陽能產業、觸控面板產業,都是十分重要的ㄧ個環節,直接影響著良率的高低。 本實驗針對如何藉由實驗之設計,將銅金屬薄膜和ITO薄膜由原先的分別蝕刻,改變為一次性蝕刻,藉以加快生產速度、提升良率。

關鍵字

銅和ITO蝕刻

並列摘要


Abstract Since 2009, the development of touch panel products has entered a new era .In 2010 ,the sales of smart phones、tablets and Notebook are soaring, which contributed to a forty percent increase or more in the market of touch panel products. Among them, the projected capacitive touch panel is the star product. However, the process of manufacturing this product is intricate. The process time and costs remain high, and the yield is still not satisfactory. Therefore ,to better the situation has become an important issue. The manufacturing process hereby is mainly about lithography process. In the current on technology industry, Etching process is a very important step whether in the ‘display’、’solar cell’、and ‘touch panel ‘ industries. It has a direct impact on the product yield. This experiment aims at changing the original copper layer and ITO layer etching into the one-step etching. By that, it speeds up the production and improves product yield.

並列關鍵字

etching ITO copper

參考文獻


[1] 郭俊賢,銅在酸性溶液之蝕刻研究,碩士論文,國立台灣大學,化學工程學研究所,2004。
[7] Hiroshi Nagaishi, and Munetoshi Fukui, and Hisao Asakura, and Aritoshi Sugimoto , "Defect Reduction in Cu Dual Damascene Process Using Short-Loop Test structures," IEEE Transactions on Semiconductor Manufacturing, Vol. 16, No 3, 2003
[8]Al-Kharafi, F. M. and Ateya, B. G., J. Electrochem. Soc., 149, 2002
參考文獻
[2]莊達人,VLSI製造技術,台北、台灣,高立書局,6版, 2006。

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