軟性顯示器基板製程預熱時間及溫度影響微粒沉積之研究

A Study of the Effect of Pre-Baking Time and Temperature on Particle Deposition onto the Flexible Display

石東贊(Tung-Chan Shih)

指導教授 ： 蔡瑞益

中原大學/工學院/機械工程研究所/碩士(2014年)

https://doi.org/10.6840/cycu201301126

摘要

摘要
軟性顯示器製程是在玻璃基板上塗佈一層聚亞醯胺材料，接著進行高溫烘烤環化製程，完成後就在其上方繼續開始一般軟性TFT(Thin Film Transistor)製程及軟性模組製程，最後再利用Laser beam穿過玻璃將聚亞醯胺膜層與玻璃分離，如此就可以用聚亞醯胺膜取代玻璃基板來達到可撓曲的效果。
本研究是以狹縫式塗佈機(PI Coater)設備為實驗機台，過程中利用自動光學檢測機(Automated Optical Inspection, AOI)進行粉塵數量分析，藉由修改聚亞醯胺塗佈後的預熱時間及溫度，使聚亞醯胺在高溫烘烤環化製程前，提升膜面的固化程度，使粉塵只會掉落在膜面上不會崁入在膜層中，就可以利用聚亞醯胺洗淨製程將粉塵去除。
實驗結果顯示，將預熱時間由8分鐘增加至16分鐘，預熱溫度由原本製程設定的110℃提升至160℃時，高溫烘烤環化製程中掉落的粉塵能夠更有效的在洗淨製程中被去除。

關鍵字

微粒沉積 ； 預熱時間

並列摘要

Abstract
The manufacturing process of flexible displays is to coat a glass substrate with polyimide and accordingly preceeds a high temperature baking cyclization accordingly. Later, TFT process as well as flexible Moduling process are applied above. Finally, separate PI film and glass by using Laser beam. This way, the flexibility effect can be achieved by substituting the glass substrate with PI Film.
PI coated is used as the experimental machine in this research. During the process, AOI is used to analyze the volume of particle. By changing the time and temperature for pre-baking of the polyimide coat to increase the curing degree of film prior to high temperature baking cyclization, so that the particle will fall upon the film rather than inlay in each film layer. Thus, the particle can be removed in Rinse process.
Experimental results shows that particle produced during high temperature baking cyclization can be removed more efficiently as long as the pre-baking time is extended from 8 minutes to 16 minutes while the default temperature 110℃ is increased to 160℃.

並列關鍵字

Pre-Baking ； Particle

參考文獻

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