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  • 學位論文

內部式感應加熱模具模溫控制方法建置與分析之研究

Investing on the Establishment and Analysis of Inter-Induction-Heating for Rapid Mold Temperature Control

指導教授 : 陳夏宗 施延欣
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摘要


近年來,高模溫與搭配熱壓成型製程可解決傳統塑膠射出成型中成型品壓力不均之限制,特別是薄殼、微小/微特徵等之應用。對於熱壓成型製程中,產品良率穩定性之需求,製程中包含牽涉許多影響因素,而模具溫度變化的控制將是關鍵。熱壓製程中模溫對成品的影響如收縮、翹曲變形、光澤度、燙傷等缺陷產生。基於此背景,在不改變製程與增加成本的負擔條件下,業界不斷的發展與優化製程來因應市場對於高質量塑膠產品的需求。 本論文分為兩部分,首先研究內部式感應加熱與內部電阻加熱方式之效率比較,並評估加熱速度與溫度均勻性,確認兩者效益與應用性。第二部分,建置四種設計於基礎內部式感應加熱之線圈通道與冷卻水路排列方式,進行模具動態溫控技術與控制系統,並驗證其可行性與效率,同時搭配ANSYS®製作3D基礎模仁溫度場分析與熱傳分析驗證。 研究結果顯示,內部式加熱法中使用感應式加熱不僅提升加熱效率也大幅改善了溫度均勻性,相較於電阻式升溫速率明顯提升73.4%,於內部式感應加熱基礎設計中,使用設計一模仁升溫速率為0.71oC/s;設計二模仁升溫速率為1.45oC/s;設計三模仁升溫速率為2oC/s;設計四模仁升溫速率為1.36oC/s,由此結果可知感應線圈通道與冷卻水路的排列方式將影響升降溫速率與製程週期。 在實驗與分析中,將感應線圈埋入模具內部進行基礎模板測試,利用ANSYS®應用於3D基礎平面模仁溫度場模擬分析與實驗結果之趨勢相當接近,成功建立內部感應加熱3D磁-熱耦合模擬分析技術。

並列摘要


In the recent years, mold rapid heating technologies have been developed all the time. In order to make the mobility of plastic and the replication of micro-structure higher or shorten cycle time, the objective of rapid heating technologies is to raise the mold temperature higher and cool down quickly. Based on this technology, many industries continue to develop new rapid heating technology for increasing the production quality. In this study the Experiment would use the mold temperature control and inter induction heating with mold plate for the mold base for heating experiments efficiency by changing the mold plate of different mold design of change the induction channel and cooling channel layout, there are four type of the mold, Simulation technology was also developed by integration of both thermal and electromagnetic analysis modules of ANSYS. The results showed that using inner induction heating can improve and enhance effectively the template heating rate. Under template of design mold, inner induction heating mold with the Design1 can get 0.71℃/s of heating rate; with the Design2 is 1.45℃ /s of heating rate; with the Design3 is 2℃ /s of heating rate; with the Design4 is 1.36℃ /s of heating rate. This results show that the heating efficiency of the induction channel and cooling channel layout. ANSYS used in 3D planar template based on analysis of temperature field simulation and experimental results are quite close to the trend.

參考文獻


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被引用紀錄


蔡碧霖(2017)。內外部導磁體搭配多層式線圈於感應加熱提升溫度均勻性之研究〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201700053
徐嘉樑(2016)。導磁體設計搭配多層式線圈應用於感應加熱均溫性提升之研究〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201600569

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