新型白光LED免封裝晶片技術

免封裝晶片已成為封裝的發展趨勢，本實驗使用覆晶二極體來製作免封裝晶片，不但可提高散熱[1]並增加出光角度，且能免除傳統打線的失效，簡化製程提升良率，縮小封裝面積。另外，使用平坦化機台製作螢光膠層，可減少螢光粉用量，達到控制成本的目的，減少色偏。經由實驗分析知消耗功率為1W時，電流350mA，色溫3000K(以下稱WFC-3000)封裝體光通量為104.41lm，色溫4000K(以下稱WFC-4000)封裝體光通量為113.74lm。持續點亮30分鐘，色溫3000K熱穩定時的光通量為90.43lm。色溫4000K熱穩定時的光通量為99.48lm。與傳統封裝5630相比光衰可降約為1-2%。

關鍵字

免封裝晶片、熱穩定

並列摘要

This paper introduces a novel package-free chip (PFC) fabrication technology for white LED. It also reports the characterizations of optical properties and thermal effect for the devices produced. The white LED PFC can increase the heat-dissipation ability and lighting angle for device’s indoor lighting applications. The white LED PFC can also eliminate the failure of wire bonding, simplify the packaging process and achieve high-yield production. The luminous fluxes of the white LED PFC measured were about 104.41 lm at 3000K and 113.74 lm at 4000K, respectively, under the applied power of 1 W. A further investigation showed that the heat steady luminous flux are 90.43 lm at 3000K and 99.48 lm at 4000K, respectively under a continuous burning for 30 minutes.

並列關鍵字

package-free chip、 thermal effect

參考文獻

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[3] S. Nakamura and G. Fasol, The Blue Laser Diode: GaN vased light

a phosphor containing a garnet fluorescent material,” United States

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[6] J. Y. Tsao, Light emitting diodes (LEDs) for general illumination:

國際替代計量

新型白光LED免封裝晶片技術

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