應用田口法優化高功率型LED散熱模組之研究

Optimal design of high power LED heat dissipation module using Taguchi method

黃赫群(He-Chun Huang)

指導教授 ： 許政行

中原大學/工學院/機械工程研究所/碩士(2013年)

https://doi.org/10.6840/cycu201300718

摘要

LED的轉換效率約為15%~25%，其餘的75%~85%以熱的形式散出，若沒有妥善的散熱模組將熱散出，會導致LED工作溫度過高，進而降低LED之亮度及壽命。
本文利用田口方法配合ANSYS CFX做模擬分析，目的在於找出能降低LED接面溫度之最佳因子組合，分別針對100W、120W和140W的LED功率下做田口分析，最佳因子組合在不同瓦數下都是相同的，而在所有因子中，封裝基板類型和散熱柱半徑最對於降低LED接面溫度最有貢獻度，
模擬也針對最佳化後之因子組合，在不同瓦數值下均溫板的有效熱傳係數(k)做單因子分析，結果顯示溫度由k=250 ~ k=2500之間溫差較大，而k=2500 ~ k=7500間之溫度差皆小於攝氏一度，本文之分析結果可作為往後改善的依據。

關鍵字

LED ； 田口方法 ； 接面溫度 ； ANSYS CFX

並列摘要

The conversion efficiency of the LED is around 15 percent to 25 percent and the rest of the energy will be dissipated in the form of heat .If the heat didn't dissipate properly ,it will lead to high junction temperature which will lower the luminous flux and reduce the lifetime of LED.

The purpose of this study is to find the optimal factor combination by using Taguchi method and simulation software ANSYS CFX. Taguchi method is used to investigate heat dissipation modules attached to the 100W, 120W, and 140W high power LEDs. The optimal combination of the factors for three different input heat watts are all the same ; two of the most dominating factors for reducing the junction temperature are led package type and radius of the heat sink pin.

After finding three different set of optimal factor combinations, single-factor analyses are conducted for the relation between the effective k value and the junction temperature. The result shows that the temperature drops relatively huge for effective k value ranging from 250 W/m-k ~ 2500 W/m-k compare to the k value ranging from 2500 W/m-k to 7500 W/m-k, the range of temperature difference for k values within 2500 W/m-k to 7500 W/m-k are all less than one degree Celsius . The results can be used as a reference for the commercial design of the LED lamp.

並列關鍵字

LED ； ANSY CFX ； Junction Temperature ； Taguchi Methods

參考文獻

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