酚醛環氧樹脂/無機層狀奈米複合基板材料之開發與性質研究

Preparation and Characterization of Novolac Cured Epoxy Resin/Inorganic Layered Materials Nanocompistes Applied to Copper Clad Laminate Materials

陳禮君(Li-Chun Chen)

指導教授 ： 蔡宗燕

中原大學/理學院/化學研究所/碩士(2008年)

https://doi.org/10.6840/cycu200900085

摘要

有機/無機奈米級複合材料的關鍵技術在於無機層狀材料的純化、改質與官能化，因為有機高分子與無機物質的界面要達到奈米級的混成鍵結，才能發揮複合材料的最大加成性。本研究所探討的主題分為兩部份，第一部份是人工合成無機層狀材料-層狀雙氫氧化合物(Layer Double Hydroxide，LDH)與酚醛環氧樹脂製成的奈米複合材料。第二部份是天然無機層狀黏土-CL88與酚醛環氧樹脂製成的奈米複合材料，二者均應用於銅箔基板(Copper Clad Laminate，CCL)新材料的開發。人工合成無機層狀奈米複材是以Li-Al與Mg-Al系列的無機層狀材料，使用改質劑為4, 5-咪唑二羧酸及氨基己酸進行改質，而天然無機層狀奈米複材是以有機官能化的C60-O及氯化苄二甲烴 雙改質劑進行改質。改質的目的在增加無機相與有機相的相容性，使無機層狀材料達到脫層型的分散均勻分佈於酚醛環氧樹脂中，發揮無機層狀材料的功效，提升材料物性。本研究的具體成果，在Li-Al與Mg-Al無機層狀材料/酚醛環氧樹脂奈米複合材料部份，有效降低銅箔基板的熱膨脹係數(Coefficient of Thermal Expansion，CTE)及消耗因數(Dissipation Factor，Df)，提升銅箔與樹脂間的結合力。在CL88-C60-O/ BEN無機層狀材料/酚醛環氧樹脂奈米複合材料部份，有效降低銅箔基板的熱膨脹係數、熱膨脹率、吸水率、消耗因數，提升銅箔與樹脂間的結合力及熱裂解溫度，此外，經UL94垂直燃燒測試其難燃性可達V-1等級，此結果可應用於無鹵素銅箔基板達到難燃化的方法。

關鍵字

酚醛環氧樹脂 ； 層狀材料 ； 基板材料 ； 奈米複合材料

並列摘要

Polymer/inorganic layered material nanocomposites have been studied extensively since past two decades due to their outstanding improvement in the physical, mechanical, and chemical properties. Epoxy resin is commonly used to make the printed circuit board (PCB). This work is for the preparation and study on novolac cured epoxy resin/layered materials nanocomposites.
In this experiment, one natural clay (CL88) and two synthetic LDH (both Li-Al LDH and Mg-Al LDH) were used to prepare polymer/layered material nanocomposites. These nanocomposites are applied to make the copper clad laminates (CCL). Li-Al LDH was modified by 4,5- imidazoledicarboxylic acid, whereas Mg-Al LDH by 4,5-imidazole- dicarboxylic acid and 6-aminocaproic acid , respectively. The bifunctional modifier viz. organic-C60 (C60-O) and benzokonium chloride (BEN) were employed to modify natural clay (CL88). The purpose of modification of inorganic latered materials is to improve the accessibility and compatibility between the organic polymer and inorganic materials so that the nano-clay or LDH can be dispersed in the novolac cured epoxy resin matrices. The exfoliated nanocomposites enhance the physical properties. It has been observed that both the novolac cured epoxy/Li-Al LDH nanocomposites and novolac cured epoxy/Mg-Al LDH nanocomposites not only decrease the coefficient of thermal expansion (CTE) but also the dissipation factor (Df). The bonding between copper foil and resin has been reinforced. The CL88-C60-O/BEN/novolac cured epoxy nanocomposites decrease the coefficient of thermal expansion (CTE), moisture absorption and dissipation factor. The bonding between copper foil and resin and thermal decomposition temperature are increased. In addition, the vertical burning test of UL94 can achieve V-1 grade. This material may be applied for halogen-free copper clad laminates.

並列關鍵字

laminate material ； nanocomposite ； Novolac epoxy ； layer material

參考文獻

Press , 1973.

5. H. V. Olphen,” Clay colloid Chemistry”, Chapter V, Wiley-Interface

Publication, New York, 1997.

6. S. Emanuela, Clays Clay Miner., 2005, 53, 179.

12. T. Pinnavaia, J. Science , 1983, 220, 365.