薄膜滯熱方式應用於模具表面溫度控制與分析之研究

Study on the Mold Surface Temperature Control and Analyses Using Thin Film for Heat Hesitation

王奕超(I-Chao Wang)

指導教授 ： 陳夏宗

中原大學/工學院/機械工程學系/碩士(2008年)

https://doi.org/10.6840/cycu200800395

摘要

隨著射出成型技術的進步，許多製程相繼被開發及研究， IMD模內裝飾射出成型技術更是在3C市場被廣泛使用，因此薄膜在此製程中則變成一重要因子，再者，IMD模內裝飾射出成型的製程在學術上又無較多的文獻及相關資料之發表，所以薄膜在此則沒有較深之探討，所以造成常常在製程中找不到解決問題的方法，本論文則針對薄膜在模穴中所造成之滯熱溫度歷程作一探討。
本論文中，首先針對不同塑膠材料以及不同薄膜材料來作一溫度的量測比較，之後再固定材料與薄膜進行不同模具溫度及熔膠溫度對薄膜滯熱溫度作探討，接著利用2D分析軟體COMSOL及3D分析軟體Moldex3D對於實驗作一驗證，並對於實驗無法量測之熔膠與薄膜接觸溫度作一分析並進行薄膜初始溫度的探討，最後再利用分析改變薄膜熱傳導係數去觀察其相關溫度歷程變化的影響。
研究結果顯示，改變熔膠溫度以及模具溫度對於薄膜滯熱溫度的影響不大，幅度約為0.2℃～4℃，而在薄膜初始溫度的影響幅度則為12℃～17℃，薄膜熱傳導係數的影響幅度約為9℃～11℃。在分析結果方面，COMSOL分析值與實驗值誤差僅2℃～4℃，而Moldex3D的分析值由於網格計算時間長久以及需要準確的環境設定，所以分析結果較實驗值小約10℃左右。
從本研究中可了解塑料物性、薄膜設計、模具溫度變化與熔膠溫度變化對滯熱效果之影響，相關研究成果可提供模具製造業者與射出成型業者作為模具設計與成型之參考，並建立初步的薄膜滯熱溫度歷程資料庫，期待未來可作一更完整之研究。

關鍵字

薄膜 ； 薄膜滯熱 ； 表面溫度控制

並列摘要

In retrospect, along with the progress of injection molding, several process have been discovered and researched, techniques of IMD (In Mold Decoration) especially has been used extensively in the market of 3C products. Therefore, The film has been found to be an important factor in this process.
Firstly, the comparison on the temperature will be made between various plastic and film materials; secondly, by controlling the material and film, analyses will be made on what influences that different mold temperatures and different melt temperatures will bring to affect the hesitation temperature of the film. At last, this experiment will be tested again by using the 2D software COMSOL and 3D analysis software Moldex 3D; meanwhile, further examination will also be made over melt and contact temperature with the film, which can not be measured in this study, followed by the analysis on the initial temperature of the film. Finally, The observation on the impact of thermal conductivity of the film and to see the relevant changes of the temperature of the film during the experiment process.
It was found that the change on temperature of melt and the temperature of mold did not bring absolute influence to the hesitation temperature of the film. The proximate range of the effect is 0.2℃～4℃. The resulting influence of initial temperature of the film is 12℃～17℃ and 9℃～11℃ for the film of the thermal conductivity data. The result from COSMOL analysis showed only 2℃～4℃ deviation from the result in the experiment; the resulting temperature from Moldex3D however, is 10℃ smaller than the temperature from experiment.
In summary, it is shown from the study that what effect of the material characteristic, film design, temperature change of mold and temperature change of melt have on hesitation effect. In further, it can set up as a preliminary temperature profile data base of the film hesitation, future research can use them for better prediction.

並列關鍵字

Hesitation of the film ； Film ； Mold surface temperature control

參考文獻

3. 陳彥成，射出成型模具表面鍍層滯熱方法建置、分析與應用之研究，中原大學機械工程學系研究所博士論文(2005)。

6. 黃宗偉，IMR模內轉印射出成型製程之研究，中原大學機械工程學系研究所碩士論文(2006)。

1. 王荷翔，利用變模溫改善超臨界微細發泡表面品質之研究，中原大學機械工程學系研究所碩士論文(2007)。

5. 黃仁德，PC/TPU 薄膜模內貼合射出成型製程特性之研究，中原大學機械工程學系研究所碩士論文(2002)。

7. 邱林雄，金屬濺鍍於PET薄膜與模內貼合射出成型製程特性之研究，中原大學機械工程學系研究所碩士論文(2006)。