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  • 學位論文

單一散熱機構設計之群組化高功率LED燈研究

A Study of a Group of High Power LED Lamp with Single Heat Transfer Mechanism

指導教授 : 許政行

摘要


LED電光轉換效率約20%~30%,剩餘的70%~80%皆轉換成熱的形式散失,所以若沒有妥善的散熱機構會則造成工作溫度過高,進而縮減LED之使用壽命。   本文使用CFD軟體ICEPAK模擬高功率LED之散熱模組,係以實驗數據與模擬數值相互比對,以確立其數值模擬之基本參數,藉此改變散熱模組中熱管與風扇之邊界條件,分析LED及散熱鰭片之溫度。   研究結果顯示鰭片溫度誤差於2%以內,而LED溫度誤差於1.3%之內。其結果顯示多組LED可使用熱管連結並藉由單一散熱模組進行散熱,而共同使用熱管與風扇則可有效降低LED溫度;在LED組數部分,模擬結果顯示增開一組LED其整體LED平均溫度約增1.02倍。

關鍵字

CFD軟體 熱管 發光二極體

並列摘要


LED has an electric-optic conversion efficiency (electrical to optical conversion efficiency) of 20% to 30%, with the remaining 70% to 80% converted into thermal energy. Therefore, without a well-arranged heat dissipation mechanism, the operating temperature will be too high, thus shortening the life-span of LED.   In this study, the thermal module of simulating high power LED with CFD (Computational Fluid Dynamics) software ICEPAK is applied. The experiment data and simulation value/numerical simulation are compared to establish the basic parameter of its numerical simulation, thereby changing the boundary condition of the heat pipe and fan of the thermal module and analyzing the temperature of LED and heat sink.   In conclusion, the research results showed that the temperature error of fin is within 2%, whereas LED has a temperature error of no more than 1.3%. The results also showed that multiple LED can be connected by using heat pipes and dissipated with single thermal modules. Moreover, the temperature of LED can be effectively reduced by the mutual use of heat pipes and fans. In regards to the number of LED sets, the thermal results showed that by adding a set of LED, the average temperature of the whole LED is increased by 1.02 times.

參考文獻


【26】 虎門科技股份有限公司,2004,“ICEPAK教育訓練講義”。
【2】 Arik, M., Petroski, J. and Weaver, S. 2002, “Thermal challenges in the future generation solid state lighting applications: light emitting diodes, ”IEEE Inter Society Conference on Thermal Phenomena,” pp.113-120.
【3】 Park, J. and Lee, C. C. 2005, “An Electrical Model With Junction Temperature for Light-Emitting Diodes and the Impact on Conversion Efficiency,” Electron Device Letters, IEEE, Vol.26, No. 5, pp.308-310.
【4】 Christensen, A. and Graham, S. 2009, “Thermal Effects in Packaging High Power Light Emitting Diode Arrays,” Applied Thermal Engineering, Vol.29, No. 2-3, pp.364–371.
【5】 Kim, L. and Shin, M. W. 2007, “Thermal Resistance Measurement of LED Package with Multichips,” IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, PP.632-636.

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