- 學位論文
微影製程中光阻塗佈膜厚之探討
Investigation of film thickness of photoresist coating in lithography
摘要
在TFT-LCD面板產業中，各家廠商競爭激烈的情況下，面板廠的工程師持續改善議題不外乎是增加生產效率及降低生產成本或者是研發新式產品或新式技術。將市購品中較為低價的光阻劑(Photoresist)，作為生產的實際應用則是本研究最主要的目的，而光阻液如何能夠均勻(Uniformity)塗佈在面板上，已成為面板廠在重要製程控制的一環。 在微影製程(Lithography)中，使用兩種不同黏度的光阻劑進行實驗。透過一系列的評估實驗:旋塗轉速、光阻劑量、軟硬烤溫度、顯影浸液。在實驗設定的區間內，控制製程參數，觀察隨之改變的結果，進而判定光阻劑符合生產條件。 經由實驗結果得到：塗佈轉速越高光阻膜厚越薄、光阻劑量越多均勻性越佳，劑量增加至飽和狀態則均勻性不在增加、軟考溫度越高光阻膜面附著力越好、硬考溫度越低則利於後製程剝膜，利用硬考溫度的變化觀察得到所需要的圖形邊緣輪廓(Edge profile)。 本研究報告在於建立一套方法，評估不同種類光阻劑於微影製程應用。對後續運用不同光阻劑時，由實驗結果的趨勢觀察，有利於縮短調整時間，較快找出適合生產的製程參數，優化整體生產效益。
並列摘要
Under the highly competitive of TFT-LCD panel, the most common issue for engineers are to increase manufacturing efficiency, decrease the production costs, and invent new products and technology. The purpose of this study is to discuss how to use the cheaper photoresist in a practical application of the production. Thus how photoresist uniformity coating on the panel has become an important controlling process of panel factories. In the lithography process, an experiment is done by using two different viscosity photoresists. After a series of experiment with different spin-coating turned speed, photoresist dosage, soft-bake and hard-bake temperature, and development immersion liquid; control the parameters of process and observe its variations, then determine which photoresist is confirmed to production condition. The experimental results with show that the higher spin speed the, photoresist film thickness gets thinner and the more volume leads to the better uniformity. But increasing the dose to saturation, uniformity has no further change. The higher soft-bake temperature, the stronger adhesion on photoresist film surface and the lower hard-bake temperature is conducive to stripping. Also through the observation of the changing of the hard-bake temperatures could figure out the edge profile. In this study, an experimental method is established to evaluate the effects of several parameters on the film thickness for different photoresist in the lithography. To the follow-up use different photoresist, the observed experimental results can reduce the adjustment time to find out the suitable process parameters and that increases whole efficiency in production.