實驗設計法以決定不同電鍍藥水和影響錫鬚形成之關鍵因素的信賴度

Designed Experiment to Determine the Reliability of Various Commercial Plating Baths and the Key Factors Affecting Whisker Formation

徐政雄(Cheng-Hsiung Hsu)

指導教授 ： 陳夏宗

中原大學/工學院/機械工程研究所/碩士(2006年)

https://doi.org/10.6840/cycu200600388

摘要

無資料

關鍵字

恆溫恆濕試驗 ； 冷熱循環試驗 ； 時效處理 ； 錫鬚

並列摘要

Abstract
In order to develop a reliable Lead-free substitutes applying on soldering application for electrical component, six hazardous substances includes Lead shall be restricted in a bittiest level claims by RoHS since July 1st 2006. Traditional SnPb was implementing on soldering material, not only to downgrade the melt temperature of solder, but also to restrain the Sn whisker as bridge to avoid circuit shorting on equipment.
The response variables included whisker density, whisker length, solderability, and solder joint reliability. We used total whisker length for data analysis but also measured “effective whisker length” for comparison under eight conditions. The eight main input variables for this DOE included; tin baths-3 levels, nickel thickness-2 levels, topcoat type-2 levels, topcoat thickness-2 levels, preconditioning-2 levels, aging environment-3 levels, aging duration-7 levels, and observed stress zones-4 levels. We also collected some data on no nickel versus nickel. Our test vehicle was a surface mount R/A header.
We statistically analyzed all results that were collected monthly over a six-month period and were able to draw conclusions about which input variables significantly retarded or promoted whisker growth. The results present five times on whisker quantity between SnPb and pure Sn, and one-fifth on whisker length. Moreover, an effective and rapid method was found to speed up the whisker growth with thermal cycle and heat & humidity tests.

並列關鍵字

thermal cycle ； Sn whisker ； heat & humidity ； aging treatment

參考文獻

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12. S. Lal and T. Moyer, “Role of Intrinsic Stresses in the Phenomena of Tin Whiskers in Electrical Connectors,” presented at ECTC conference, Las Vegas, (2004).

參考文獻