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  • 學位論文

單晶銅於奈米壓入之應變分析

Strain Analysis in Nanoindentation of Single Crystal Copper

指導教授 : 張永鵬 康淵

摘要


本文探討單晶銅於奈米壓入試驗中,其壓痕周圍之凸起,所產生之壓痕硬度與壓痕模數的量測誤差,進行修正。 單晶銅於不同之加載速度,與相同之加載、持載和卸載時間之奈米壓入試驗中,使用AFM觀察殘留壓痕,其壓痕周圍皆有明顯之凸起現象產生,因凸起使接觸深度被低估,同時壓痕投影面積也被低估,造成硬度及模數被高估,而且經由載荷隨深度變化的曲線中,明顯發現不連續應變現象,本文利用AFM之壓痕圖形與理想壓針進行比對,採取壓痕稜邊與壓針稜邊相交之接觸深度,修正因凸起現象所低估之接觸深度,進而補償所低估之壓痕投影面積,得到修正之壓痕硬度與壓痕模數。 採用本文修正的公式分析壓痕實驗值,與前人研究的分析結果加以比對,得到的硬度及模數為向下修正的結果,而且隨著壓入負荷的增加,其值均能呈現穩定不變。

並列摘要


This thesis presents an experimental analysis for the determinations of hardness and elastic modulus which are influenced by pile-up phenomenon during nanoindentation of the single crystal copper. In indentation tests, atomic force microscope (AFM) is used to measure load-depth curves with pile-up and strain burst phenomena. On the basis of original shape of indentation tip, the correct contact depth according to the point of line tangent to edge is obtained for the correction of contact projected area which replaces the one which is obtained from direct measurement. It is reliable to modify indentation hardness and modulus of the single crystal copper by using present method. The modifications of indentation hardness and modulus in this thesis are downward when they are compared with previous researches. Also, the stable values of these modifications as indentation load increasing can be obtained.

參考文獻


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