考慮週期時間的最小化封裝晶片在製品數量之彈性流程型工廠排程問題

Minimizing WIP of IC packaging on flexible flow-shop scheduling with cycle time.

吳冠伶(KUAN-LING WU)

指導教授 ： 黃文佐

中原大學/商學院/企業管理學系/碩士(2022年)

https://doi.org/10.6840/cycu202201494

摘要

本研究以半導體封裝測試業為主要研究對象。近年來半導體產業蒸蒸日上，全球市場龍爭虎戰，其中為半導體產業鏈的後段封裝測試，封裝測試廠進行IC封裝再進行最終測試、測試後直接出貨。如何整合製程進而達到良好的品質、準確的交期、更短的生產週期與更高的機台運用效率以獲得更高的客戶滿意度成為業界的一大挑戰。本研究A公司半導體封裝測試廠屬於彈性流程型工廠(Flexible Flow-Shop)，生產形式大多為接單式生產(Make-to-Order，MTO)，必須提供客製化與緊急需求的服務。在封測生產環境中，限制理論(Theory of Constraints，TOC)指出產能受限資源(Capacity-Constrained Resource，CCR)之產出決定整個生產系統之產出，因此本研究導入限制驅導式排程方法(Drum-Buffer-Rope，DBR)，辨識出封裝測試廠的CCR產線，並提出一套建議排程方案以CCR為鼓排程(Drum)核心，與考慮出貨緩衝(Shipping Buffer)時間和次裝配緩衝時間、及封裝IC交期排程設定及考慮CCR緩衝時間(CCR Buffer)以利於推算封裝IC投料時間排程(Rope)。

關鍵字

週期時間 ； 封裝晶片 ； 彈性流程型工廠 ； 限制驅導式排程 ； 封裝測試 ； 半導體

並列摘要

This research takes the semiconductor packaging and testing industry as the main research object. In recent years, the semiconductor industry has been booming, and the global market is competing with tigers. Among them, the packaging and testing of the latter part of the semiconductor industry chain, the packaging and testing factory conducts IC packaging and then performs final testing, and direct shipment after testing. How to integrate the process to achieve good quality, accurate delivery, shorter production cycle and higher machine efficiency to achieve higher customer satisfaction has become a major challenge in the industry. The semiconductor packaging and testing factory of Company A in this study is a Flexible Flow-Shop, and most of the production forms are Make-to-Order (MTO), which must provide customized and urgent services. In the packaging and testing production environment, Theory of Constraints (TOC) points out that the output of Capacity-Constrained Resource (CCR) determines the output of the entire production system, so this study introduces constraint-driven scheduling Method (Drum-Buffer-Rope, DBR), identify the CCR production line of the packaging and testing factory, and put forward a set of recommended scheduling plans with CCR as the core of the drum scheduling (Drum), and consider the shipping buffer time Set up and sub-assembly buffer time, and package IC delivery schedule and consider CCR buffer time to facilitate the estimation of package IC delivery time schedule (Rope).

並列關鍵字

cycle time ； IC packaging ； flexible flow shop ； DBR ； IC packaging test ； semiconductor

參考文獻

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