sensor監控應用於高性能材料優化射出參數 -以家登公司個案為例

Sensor monitoring applied to high-performance materials to optimize injection parameters - Take the case of Gudeng Company as an example

潘詠晉(YUNG CHIN PAN)

指導教授 ： 鐘文仁

中原大學/工學院/機械工程學系/碩士(2022年)

https://doi.org/10.6840/cycu202201684

摘要

奈米級晶圓在微影蝕刻成為晶片製程中，光罩載具扮演儲存、傳送與運送的重要角色。目前全世界只有兩家供應商能滿足台積電在七奈米高階製程下光罩載具的特殊規格要求，因此光罩載具在於精度要求是否足夠，是影響時刻製程良率的關鍵。
在家登精密現有射出製程中，以現有的產品，導致射出品良率低的原因大多為變形、外觀異常等，其中占比最多的為產品在射出成型中因收縮不均而導致翹曲，因此在射出後須使用治具輔助整形，依舊有5.7%的翹曲NG品需進行重工，雖能降底不良品耗損率，卻提高了整個產品的射出成型週期。
射出成型發生變型翹曲，主要的原因為溫度差異以及壓力差異，本研究計畫以家登精密的實際需求，針對變形量最大以及費用較高的peek材料(poly ether ether ketone聚醚醚酮) 材料進行分析，以原始射出參數條件進行模擬，模擬結果與舊有的射出品進行比較，整合動態模溫進行模溫控制，透過埋設sensor實際驗證，同步進行監控，改善翹曲提高生產良率，同時降低產品的射出成型週期，減少成本與工時耗用。

關鍵字

塑膠射出成型 ； 動態模溫 ； 成型週期 ； 收縮 ； 翹曲 ； 變形 ； PVT比容 ； sensor埋設

並列摘要

The nano-scale wafer plays a vital role of storage, transportation and delivery in the process of lithography and etching. There are only two suppliers in the world can meet the unique specification requirements of TSMC's mask carriers which is under the seven-nanometer advance process. Therefore, the accurate requirements of the mask carriers are the key point affecting the process yield.
In Gudeng’s existing production process, deformation and abnormal appearance are the most common issues causing the low yield of injection products. The largest proportion is that the uneven shrinkage leads the warping during the injection molding. Therefore, using a jig to shape after the injection molding is necessary.According to the statistics, there are 5.7% of the NG products need to be reworked. Although it can reduce the loss rate, it also increases the injection cycle time of the finished product.
The deformation and warping of the injection molding are mainly cause by temperature and pressure difference. This project is based on Gudeng’s actual needs, focusing on the peek (poly-ether-ether-ketone) material which has the largest deformation and higher cost, simulating the original injection parameter conditions. The results of the simulation are compared with the previous version. The mold temperature is controlled by integrating dynamic mold data, verifying through the actual buried sensor and monitoring at the same time. It improves warping and production yield, in the meanwhile, reduces the injection cycle time, cost and labor consumption.

並列關鍵字

Plastic injection molding ； dynamic mold temperature ； molding cycle ； deformation and warpage material ； sensor buried

參考文獻

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