晶圓製造產業中微影製程負責晶片中所有線路圖形的製造,由於微影製程後所產生線路圖形的複雜度與微小特性,使得晶圓檢測作業成為產品效能上相當重要的角色。而檢測方式除了自動檢測機台(Automatic Optic Inspection, AOI)外使用人員搭配工具顯微鏡檢測方式也扮演重要的角色,長時間作業條件下對於作業人員的視覺疲勞程度以及量測績效好壞會是個重要的議題。 本研究將分別以不同的量測圖型(圓形、直線)與不同連續作業時間(20mins、40mins、60mins)對作業人員的量測績效(量測失誤率、量測次數)與視覺疲勞績效(閃光融合閾值(Critical Fusion Frequency, CFF)變化量、視覺疲勞主觀評量問卷)影響程度進行實驗。 研究結果顯示量測圖型與量測時間同時對於量測績效當中的量測失誤率與量測次數兩個偵測項目皆有顯著影響,因此實際作業時若需要得到較佳的量測績效但量測物已被限制的條件下則量測時間的控制將是可以列為改善方案項目之一。另外在視覺疲勞績效的實驗結論只有量測時間會有顯著差異,量測圖型則對於視覺疲勞績效沒有一項達到顯著差異。 總合以上研究結果建議如下: (1) 針對量測數值Cpk改善則需要將作業者已連續作業時間列入確認項目並找出最適作業時間範圍。 (2) 針對作業人員視覺疲勞改善可以將量測時間定義不同區段並使用閃頻儀測出CFF數值變化量找出視覺疲勞開始時間與可接受變化量最大值對應之作業時間。
Lithography responsible for all layouts in the wafer manufacture process which is complicated and slight. Thus, wafer inspection process plays an important role on product performance. Except Automatic Optical Inspection(AOI), another important method is operator inspect wafers by microscope. This study investigates the effects of operator visual fatigue and measurement performance. This study combined two different measurement shapes (circle, linear) and three measurement periods (20mins, 40mins and 60mins). Operator’s measurement performance (failure rate, inspection times) and visual fatigue performance (critical flicker fusion frequency, visual fatigue subjective questionnaires) would be collected as the evaluations. The results show that both measurement shapes and measurement periods showed statistically significant difference on failure rate and measurement times. Thus, measurement period controlling can be an improve plan for better measurement performance while measurement sharp is fixed in actual operation. Second, only measurement periods showed statistically significant difference on visual fatigue, not measurement sharps. In summary, 1. Include operation measurement period as indicator on improving Cpk of inspection performance requires to and find the optimized range. 2. Find the marginal area of visual fatigue by critical flicker fusion frequency to improve operator measurement performance.