高速數位印刷電路板中差模信號傳輸損耗之探討

本論文針對差模信號對在傳輸時造成其損耗的因素討論，以一對差模信號對距離金屬接地層之間改變介質，來達到抑制損耗之影響，針對所提出的結構，使用3D全波模擬軟體HFSS[8]與Q3D[11]進行頻域與電場和阻抗分析，藉由觀察頻域波形與電場分佈情形，提出以部分低損耗介質取代高損耗介質，達到整體結構以低損耗介質取代的損耗，可降低低損耗介質高昂的造價，並針對傳輸線導體的表面粗糙度進行研究，因應製程上造成表面粗糙度有所差異，針對刷法與位置進行討論，討論差模信號在設計與製程上造成的損耗之分析。

關鍵字

差模信號；介質損耗；導體損耗

並列摘要

Differential mode signals, so that the transmission loss coefficient and the signal from the metal ground plane change media questions differential mode of suppressing the loss of influence of the proposed structure, the use of three-dimensional full-wave simulation software HFSS and Q3D impedance field frequency domain analysis, frequency domain waveform by the electric field distribution and observation made partially substituted, high dielectric low loss dielectric loss, to achieve the overall structure to replace the low-loss dielectric loss, a low loss can reduce the high cost of media, and can be made when the roughened surface of the conductor transmission line, resulting in slightly different surface roughness, brush method, discuss and analyze the signal loss of the location and design of the differential mode and the results achieved.

並列關鍵字

differential Signal ； Dielectric loss ； Conductor loss

參考文獻

J. Fan, X. Ye, J. Kim, B. Archambeault, and A. Orlandi, “Signal integrity design for high-speed digital circuits: progress and directions,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 392-400, May 2010.

C. R. Paul, Introduction to Electromagnetic Compatibility, 2nd. New York: Wiley, 2006.

C. R. Paul, Analysis of Multiconductor Transmission Lines. NewYork,NY, USA: Wiley-Interscience, 1994.

C. R. Paul, “Solution of the transmission-line equations under the weakcoupling assumption,” IEEE Trans. Electromagn. Compat., vol. 44,no. 3, pp. 413–423, Aug. 2002.

W. Liu and Y. Kami, “Analysis of coupling between transmission lines in arbitrary directions,” Proc. 1998 IEEE EMC Symposium, pp.952-957, Denver, Aug. 1998.

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高速數位印刷電路板中差模信號傳輸損耗之探討

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