電子連接器被焊接在印刷電路板上,從早期的穿孔焊接慢慢的演變成至今已蔚為主流的表面貼焊技術,主要因為電子產品的空間考量,要在有限的空間中放進最多的電子元件。因此為了符合表面貼焊技術的要求,電子連接器焊腳的共面度成為最重要的產品規格,其中最容易影響的因子就是連接器塑膠本體的翹曲變形。 本論文是針對0.2mm Pitch 120 PIN FPC連接器塑膠本體,在經過射出成形與SMT製程的紅外線回焊爐後,最終塑膠本體的翹曲變形量最佳化研究,先藉由Moldex3D輸入射出成形現場的原始製程參數進行CAE分析,並與實際射出實驗的塑膠本體進行比較,發現該軟體可以有效預估流動的狀況與翹曲變形的方向。 後續使用田口式實驗計畫法進行射出成形製程參數最佳化,選用直交表L18(21×37),建立一個可描述S/N比與控制因子兩者關係的試驗模式,最後進行確認實驗。確認實驗結果顯示塑膠本體平均翹曲量為0.117mm,顯示田口法有效的降低了塑膠本體的翹曲變形量54.7%。
Electronic connectors are mounted on the print circuit boards (PCB). Through hole process was initially used, while surface mount technology (SMT) is employed currently for mass production. Such a transition is due to the need to reduce the occupied space of the connectors in the PCB in the design of consumer electronics, computer and communication connectors. With this technique in use, the coplanarity of the solder pins of the electrical connector become the most important product specification. Among the various parameters affecting the coplanarity of connector housing, warpage value is the most important. The object of this thesis is to optimize warpage value of 0.2mm pitch 120 pin FPC connector housing after injection molding and infrared reflow oven in the SMT process. At first, input the original design process parameters into CAE software. Second, compare result of CAE analysis with the actual injection molding experiment, then found that the software can effectively estimate the mold flow conditions and warpage direction. Third, using Taguchi method to optimize the process parameters of injection molding. Selecting orthogonal array L18(21×37) and then establishing an experimental model described relationship between S/N ratio and the control factor. Finally, the results of the confirm experiment show that the average value of warpage of connector housing is 0.117mm. Taguchi method effectively reduces the value of warpage 54.7%.