- 學位論文
掛鍍式電鍍機夾具型式對金凸塊高度均勻度的影響研究
Research for the Fixture Type Effect of Rack Electroplating Machineon Gold Bump Uniformity
摘要
隨著黃金價格的節節上揚，平面顯示器相關產業面臨到的成本壓力也愈來愈沉重，其中驅動IC封裝製程因使用金凸塊作為IC與載板的連接元件，故受到的成本壓力最大。因此近年來驅動IC封裝產業各種節省黃金用量的方式一直被討論與研究。除評估變更封裝材料以銅鎳金凸塊取代金凸塊外，降低金凸塊高度以節省黃金用量在驅動IC封裝產業亦被持續要求，但因需考量到面板壓合的製程穩定性與預防金凸塊高度降低可能帶來的風險，故隨著金凸塊高度的降低，對金凸塊高度均勻度的要求也越來越高。本論文的研究重點為以現行使用的掛鍍式電鍍機與夾具進行金凸塊高度均勻度改善探討，期望以現行的設備搭配硬體的調整可達到改善金凸塊高度均勻度的目的。 實驗規劃預計區分為三個階段，第一階段實驗規劃以測試夾具形式為主要目的。第二階段以第一階段測試結果最佳的夾具形式進行電鍍機台的硬體製程參數測試。第三階段以第一與二階段測試結果最佳的夾具形式與硬體製程參數進行再現性測試，並與原夾具形式與硬體製程參數比較。 由三個階段的實驗結果可知以全接觸上導通的夾具形式搭配最佳製程參數相較於原6點側導通的夾具形式搭配原硬體參數，凸塊高度均勻度有優異的改善結果，凸塊高度均勻度可由原平均約3.1um改善至1.2um，改善幅度約60%。
並列摘要
The costs of assembly bonding house and supply chain are ascending with the higher and higher gold price, especially in driver IC assembly whose process utilizes the gold bumps to be the connect components between ICs and carrier substrates. Consequently, how to reduce effectively the usage of gold becomes important topic for driver IC assembly houses in recent years. In addition to gold bump material is replaced by CuNiAu bump, the requirements of reducing bump height to save cost is sustained. However, it is necessary to take the stability of bonding process into account as well as to prevent the risk of gold bump height reduction, the tolerance requirements for the performance of bump height uniformity become tightened when a decrease in the bump height is needed. For the above-mentioned reason, the major purpose of this dissertation is to study the improvement of gold bump uniformity by using present rack electroplating machine and fixture. It is the expectation to achieve the goal of enhancing bump height uniformity under the considerations of the present equipment combined the modulation of related hardware. There are 3 stages for experiment plans. The purpose of the first one is trial of different types in fixture. The second one is to proceed with the trial of electroplating parameter based on the best-performance type in the first stage. The final stage is the repeating trial under the best-performance of the first and second ones and compared to the original fixture type and parameter. According to above experiment result, we conclude that compared with the bump height performance of original 6 contacted-pins type with the corresponding process parameter, the all area-contacted type with best recipe has excellent performance in bump height uniformity whose improvement range is around 60% from 3.1um to 1.2um.