精微CNC鑽石研磨機開發應用於表面粗糙度量測之單晶鑽石探針製作研究

本研究旨在開發一部「高剛性桌上型龍門四軸精微CNC研磨機」，並規劃應用此研磨系統於製作工業界使用頻繁的表面粗糙度量測之鑽石探針。為精確量測工件面的表面粗糙度，其經常使用的探針測頭係針尖半徑為1-2μm 的單晶鑽石探針。為能對此最高硬度的材料進行研磨成形，研究首先建構一部具高剛性及高精度的精微CNC鑽石研磨系統，並設計雙主軸(Dual-Spindle)，以支援鑽石探針的粗、精研削。鑽石探針為獲致高精密快速定位及快速拆卸，本研究於研削系統上設計一「磁性吸附機構」，並能提供鑽石磨輪與鑽石探針間的研削緩衝力，避免鑽石探針素材因撞擊導致針尖破裂的問題。為獲得高同心度且銳化的鑽石磨輪，本研究提出線上研修法(In-situ truing & dressing approach)，以電鑄鑽石磨輪及線切割放電加工分別直接對高速主軸上的陶瓷結合劑鑽石磨輪及金屬結合劑鑽石磨輪進行線上修整，鑽石磨輪都無須拆卸，可節省校正時間並使鑽石磨輪保有最高同心精度。鑽石探針的加工成形採機械式(陶瓷結合劑鑽石磨輪及金屬結合劑鑽石磨輪)與機械化學式(鑄鐵盤(Scaife))的切線研削法(Tangential grinding)，可得研削之最高切線速率，提供鑽石探針素材較高的材料移除能量。經一系列實驗，證實{111}面朝上的單晶鑽石素材，進給深度0.1μm/step，切削速度4,050m/min及進給率15 mm/min與8 mm/min的研削條件下，可獲得針尖半徑1.0及3.0μm的鑽石探針，探針表面粗糙度可達Ra0.06 μm，總成形時間約4小時。最後經由工業界的表面粗糙度量測儀進行量測驗證，並與同規格之商用鑽石探針進行量測比較，本研究量測結果可達JIS 2001規範的標準差範圍。顯見本研究已成功實現針尖半徑1.0μm的單晶鑽石探針，並順利應用於表面粗糙度的量測。本研究成果具商業化價值。

關鍵字

切線研削法；表面粗糙度；單晶鑽石探針；龍門四軸精微CNC研磨機

並列摘要

The study presents the development of a high-precision, -rigidity tabletop gantry 4-axis CNC grinding machine for the study on grinding a monocrystalline diamond probe. The radius of diamond probe-head within 1-2 μm design is the most commonly used for measuring surface roughness in industry. In consideration of this, a CNC grinding system with dual-spindle design supporting rough and finish diamond grinding is constructed first. A magnetic sucking mechanism, which provides a cushioning force between the diamond probe and the diamond wheel, is designed on the grinding system to improve the accuracy of positioning of the probe and prevent crashes from occurring. To obtain a dressed diamond wheel with high co-shaft accuracy, an in-situ truing and dressing approach, by which an electroplated diamond wheel and a w-EDM mechanism are employed, is proposed in this study. The diamond wheels made with sintering vitrified bond and metal bond can all be in-situ dressed on a high-speed spindle, which requires no unloading, reloading or calibration. This saves the time of calibrating and maintaining the high co-shaft accuracy for the diamond wheels. By applying the diamond wheels and the scaife, the diamond probe grinding is conducted via mechanical and mechanical-chemical tangential grinding, respectively. The tangential grinding realizes a grinding with the highest tangential velocity, offering the diamond probe a high material removal rate. After a series of experiments, it was found that the diamond probe with 1.0 and 3.0 μm in radius and the surface roughness of Ra59 nm can be accomplished when using the machining conditions below: {111} plane upward, 0.1μm/step in the depth of feeding, the grinding speed of 4,050 m/min, and the feed-rates of 15 and 8 mm/min. The machining time is required within 4 hours. The finished diamond probe is verified by a commercial surface roughness measuring instrument and compared with the commercial diamond probes. The errors of the developed diamond probe fully conform to the standard of JIS 2001 indicating that the monocrystalline diamond probe with radii of 1.0 and 3.0 μm and an excellent surface finish can be realized and applied for measuring surface roughness successfully in this study. It is expected that the results of the study will contribute substantially to the precision micromachining industry.

並列關鍵字

tangential grinding ； surface roughness ； monocrystalline diamond probe ； gantry 4-axis CNC grinding machine

參考文獻

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