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  • 學位論文

微結構射出成型參數之研究

The Study of Parameters for Injection Molding in Microstructure Application

指導教授 : 孫書煌

摘要


國內TFT-LCD市場隨著進入量產商家的增加,整體面板供給增加與全球市場效應陸續浮現,且就長期產業發展趨勢而言,具有環保節能TFT-LCD市場的全面興起應是無庸置疑的,在TFT-LCD平面液晶顯示器中,背光模組主要是提供液晶面板均勻、亮度的光線來源,而其中導光板又為背光模組裡傳導光源之主要零組件,以提高面板光學輝度及確保亮度均勻性,進而達成控制光的散射方向,而決定導光板之光學特性主要在於表面微結構之設計,所以本研究將從導光板模具開發設計到射出條件之相關流程做分析探討。 本研究其導光板之幾何結構形狀,是以長40.58mm,寬30.8mm,厚度0.7mm之1.8吋V溝微射出平板導光板為例,使用2顆白光LED為側向入光源。而成型時所使用之塑料為壓克力樹脂PMMA材質(Polymethacrylate),在射出成型當中影響的參數有很多,本文藉由電腦輔助模流分析軟體及模具設計,已決定出成型條件,如料溫、冷卻時間、模溫、射速、射壓、保壓壓力及保壓時間等,且同時進行實作測試,最後使用田口品質實驗方法來探討導光板射出成型條件中,找出影響導光板光學輝度較大的製程因子。

並列摘要


Whereas the uprising of Multiple-Vendors and the overall supply chain worldwide, It is no doubt that TFT-LCD is coming to be the main trend in the field of TFT-LCD industry by its own feature – Energetic Saving Capability. In the construction of TFT-LCD Display, BKL Module is mainly to offer the light, in the mean time LGP comes as the key point in sourcing light evenly and remaining the stability of optics to reach the controlling of light. This chronicle is to discuss the procedure from design, mold development and injection to make all parameters possible. To take the appearance of LGP – length 40.58mm, width 30.8mm & thickness 0.7mm (The size is taken at 1.8 inches pluses with 2 LED as the source of light) – for instance, it takes a lot of parameters over the process of LGP injection (The material is PMMA – Polymethacrylate) in response to this, we might experiment the conditions of injection such as cooling time, Temp on Mold & Parts, cycle time, pressure, and filled in stress (To exam by Program Software & Mold Design) ,and to be measured under Taguchi Quality Experiment Standard in order to make the best parameter in building Optical Brightness and the specialization of micro-construction. Key Words: BKL Modules, LGP, LED(Light Emitting Diode), Taguchi Quality Experiment, Optical Brightness.

參考文獻


〔5〕張自恭,“背光模組光學設計”,光電科技工業協進會,光連雙月刊,民國九十三年。
〔7〕科盛科技編著,“CAE模流分析技術入門與應用”,科盛科技股份有限公司,新竹市,民國九十一年六月初版。
參考文獻
〔1〕陳劍鋒,“電腦輔助工程應用於射出成型品收縮之驗證”,國立清華大學碩士論文,民國八十六年。
〔2〕陳宗平,“微射出模溫控制系統及微結構轉寫能力探討”,國立台灣大學機械工程學研究所碩士論文,民國九十年。

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