低溫離子束沉積含氮類鑽碳與二氧化矽薄膜在 不同含氮量下的界面附著性與機械性質之研究

The Adhesive and Mechanical Properties Study of a-C:H(N) and SiO2 Thin Films Deposited by Low Temperature Ion Beam Process under Various Nitrogen Contents

葉日邦(Jih-Pang Yeh)

指導教授 ： 朱孝業

崑山科技大學/工程學院/機械工程研究所/碩士(2005年)

摘要

本論文主要目的在評估矽晶圓基板上以低溫離子束電漿強化化學氣相沈積製成不同含氮量與膜厚之類鑽碳(a-C:H(N))薄膜，並以不同膜厚之二氧化矽薄膜作為中間層之試件，經由奈米測試機進行刮痕試驗之結果來探討界面附著性。從試驗之臨界負荷高低來比較中間層之有無對鍍層附著性的影響。此外，利用表面形貌精密量測儀驗證刮痕試驗中雙層薄膜破裂的模式。在試片的檢測部份，我們使用拉曼光譜儀和薄膜光學性質量測儀來分析薄膜之鍵結以及薄膜的厚度與光學性質。由實驗結果得知，在類鑽碳薄膜與矽晶圓之間加入二氧化矽薄膜做為中間層並未如預期能改善與底材之附著力，反而是與頂層之類鑽碳薄膜有較好的附著效果，而中間層的厚度須和類鑽碳薄膜的厚度有適當的搭配，才能對鍍層附著性有所改善。
此外，雙層薄膜的破裂模式，在刮痕距離對應摩擦力圖中若出現兩段不同斜率之線段時，其斜率變化起伏處為雙層薄膜承受臨界負荷產生同時破裂的情形，第一段摩擦力線段為雙層薄膜均未破裂，球形探針在薄膜表面量測之摩擦力變化曲線，而第二段斜率改變後之摩擦力線段則是鑽石球頭刮破雙層薄膜並持續刮觸底材所引起之摩擦力震盪。

關鍵字

臨界破裂點 ； 臨界負荷 ； 類鑽碳薄膜 ； 二氧化矽薄膜 ； 奈米測試機

並列摘要

The adhesive and critical loads of a-C:H(N) and SiO2 thin films deposited by low temperature ion beam process under various nitrogen contents are researched by scratch tests in this study. The effect of nitrogen containing and film thickness to the adhesive force is involved, too. In experimental parts, the critical loads are measured from scratch test by the NanoTest. In examining samples, we measured bonding and optical properties, film thickness by Raman spectrum and thin film metrology. According to the experimental results, With the addition of SiO2, the films adhesion strength between the SiO2 and wafer is lower than that without SiO2 as the inter-layer. This is contrary to the common belief that the addition of SiO2 is advantageous in adhesion. However, the thickness of SiO2 is not arbitrary, only certain thickness ratio with DLC films improves the quality of the overall property.
The mode of cracks in the double-layer film during scratch test is analyzed. There are two linear segments with distinct slopes appeared in the friction force vs. scratch depth diagram. The first line segment indicates the friction force measured form the top layer before cracking. Both films cracked simuttaneously when the load increased and reached to the so-called critical load. This phenomenon is analzed with the aid of surface profile analyzer. The second line segment indicates the friction force measured as the spherical probe moved on the surface of the substrate with cracking the dual films above the substrate.

並列關鍵字

NanoTest ； Critical Load ； Critical Point ； SiO2 Thin Films ； Diamond-Like Carbon

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