此論文提出以微機電(MEMS)製程技術的面微矽加工(Surface micromachining )技術,直接在矽基板上沈積薄膜,再利用體微矽加工(Bulk micromachining)技術,將矽基板蝕刻留下空腔體的薄膜,讓介電係數近似於1,接著配合使用微帶線濾波器和方向耦合器的原理,製作微帶線的帶通濾波器和在氧化鋁基板上製作方向耦合分波器,最後結合濾波器跟耦合器分波器形成一個雙頻帶多工濾波器,以分波器當分工器來選擇頻帶,此分工器結合了微機電製程元件的低成本、小體積、性能佳、IC製程相容性高,並有效的降低微帶線的介質損失(Dielectric Loss )和導體損失(Conductor Loss ),接著採用平面式濾波器常用的微帶線,設計可抑制高次諧波,並且擁有較大頻寬的開迴路共振器、步階式多段式阻抗共振器和雙模態共振器製作帶通濾波器,最後結合耦合器分波器和濾波器,讓此元件有分工濾波器的特性。
Combination of bulk micromachining and face micromachining techniques, we present a radio-frequency MEMS stepped open-loop resonator bandpass filter in this paper. By anisotropic etching, a very thin 4mm′4mm dielectric membrane with relative dielectric constant (er»1) was fabricated on a silicon substrate. This structure could effectively reduce the dielectric loss and conductor loss of a microstrip line. This filter pattern composes of two open-loop resonator with asymmetric tapping feed lines. By using the high-frequency printed circuit board as the substrate, the improved stepped open-loop resonator bandpass filter has better performance as compared with the traditional one. . In addition, the MEMS stepped open-loop resonator bandpass filter combination direction couple multiplexes shows its superior performance with power divider function.