高亮度藍色發光二極體之新式封裝技術

Novel Package Technique of High Brightness Blue Light Emitting Diodes

黃金泉(Jin-Quan Huang)

指導教授 ： 林俊良

崑山科技大學/工程學院/電子工程研究所/碩士(2006年)

摘要

目前市場上的發光二極體不論是磊晶或是製程，技術不斷的進步、發光效率也不斷提昇，但散熱問題卻依然仍待改善。LED必v持續提昇，伴隨而來的卻是影響其壽命與發光效率甚嚴重的熱能累積。
熱的累積，從發光二極體封裝由外而內包含了散熱片、封裝用支架、晶粒/碗杯接面材料與晶粒本身。傳統的晶粒封裝使用膠體將晶粒與碗杯或金屬散熱座接合，不論是透明膠或是高導熱的銀膠，其膠體熱導值均很小，這也意味著具有相對的高熱阻值。在本論文中我們利用金屬與晶粒直接接合技術，減少接面熱阻值、提高熱導出能力，也大幅改善因為熱傳導不良所產生的晶粒光電特性衰減問題。

關鍵字

膠體 ； 銀膠 ； 封裝 ； 發光二極體 ； 金屬

並列摘要

Now the process technique of light emitting diode (LED) is continued to leap forward, however heat dispassion is still unresolved. Therefore, the life-time and output efficiency of LED is serious because of the accumulated heat.
In this thesis, we have resolved the heat problem in package level. The package components of LED are heat sink, lead frame, joint material in the interface between LED chip and reflective cup, and the body of chip. Conventional joint material between LED chip and reflective cup is gel, with high thermal resistivity, consisted of organic material with/without metal particle. We have proposed a new technique to overcome the thermal problem by embedding the LED chip in metal heat sink directly. Optical and electrical characteristics of LED have improved by this new technique obviously.

並列關鍵字

package ； metal ； gel ； silver epoxy ； LED

參考文獻

[1] 李季達，“日本白光LED 照明產業訪談紀要”，光連Optolink，第29期，徐國安，八十九年九月

[2] 施敏，半導體元件物理與製程技術，黃調元譯，國立交通大學出版社，新竹，2002，第二版

[3] 詹宗文，高標科技，“圓弧平底凹杯之LED製作方法”，公告編號488085，中華民國專利，2002

[4] H.L. Kwok, “Electronic Materials”, PWS Publishing Company, University of

Victoria, Chapter 4.5 The Emission Process, luminescence, page 249~251.