LED背光模組散熱系統設計及分析

Analysis and Design of A Cooling System for LED Backlight Module

黃啟偉(Chi-Wei Huang)

指導教授 ： 王文榮

共同指導教授 ： 林水木(Shueei-Muh Lin)

崑山科技大學/工程學院/機械工程研究所/碩士(2008年)

摘要

由於LED 技術的進步，LED 應用亦日漸多元化，並將廣泛的用於背光模組上。由於高功率LED 輸入功率僅有15~20%轉換成光，其餘80~85%則轉換成熱，造成LED 產品生命週期、亮度、產品穩定度，隨著介面溫度提高而衰竭。本文針對 LED 背光模組的散熱，設計一套成本低、不需維護、可有效將熱帶走的散熱模組。LED 背光模組的熱源很多且是分散的，不同於傳統集中熱源系統(如CPU)，故散熱設計必須有別於傳統者，否則，成本過高或無法有效帶走熱量。利用數值方法證明其有效性，研究不同參數對LED 燈在背光模組上的散熱的影響，找出最佳化設計，使更具市場上競爭力。

關鍵字

LED ； 背光模組 ； 散熱模組

並列摘要

As a result of advancement of LED technology, the application of LED has been applied in many fields, for example, in the back light mode technology. Only 15~20% of the input power of a high powered LED can be transformed into the light energy, the other parts into the heat energy. The brightness and stability of a LED will decay as the temperature increase. In this thesis, an innovative cooling system for LED Backlight Module is design and analyzed. This cooling system is low-cost and lowmaintenance. Its performance of cooling is very good. The LED backlight mold has massive heat sources. It is different to traditional centralized heat source system (Ex: CPU). Therefore, the radiation design must be different to the tradition one. If the conventional design is applied to this mold, its cooling performance will be poor or high-cost. This new design is certificated validity by using the numerical analysis method. Finally, the effects of some important parameters on the cooling performance of the back light mold are investigated. The optimum design is found. Based on this design, the LED backlight mold will be more
popular in the recent market.

並列關鍵字

LED ； Back Light Mode ； Thermal Module

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