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  • 學位論文

介質導熱固化層應用於照明模組之研究

The Study of Lighting Module by Applying the Conductive and Cured Dielectric Layer

指導教授 : 陳文瑞
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摘要


本論文是針對發光二極體和散熱體做結合,二者中間的導熱材料對光效、溫度傳導分析,採用多晶方式封裝在單一支架上,此方式為集中式光源,會出現晶片過度集中,熱無法在有效的面積下快速將熱導致散熱體。封裝完成的發光二極體有分成副載具和無副載具二種方式,主要是要測試少了載具對光效的影響。如何在小面積上能夠有效的把熱迅速的導熱出來,使用了四種導熱材料來做測試,不同的材料會使用在不同的產品上每一種都有它的優勢,在選擇同時會考慮機構上組配對熱、光的影響分析。分別使用3W、6W、9W功率來做測試,3W、9W可以做明顯差異性比較,6W是實驗LED標準測試瓦數,來做溫度、光衰量測、加速壽命實驗,依材料不同來做每一種項目的測試。 使用導熱膏、固化型散熱膏、鋁膏、導熱雙面膠四種的材料來做實驗,測試支架的折角點和最遠的測試點,如溫差太大表示熱積在LED沒有把熱順利導出來熱阻也相對較大,光衰的幅度較嚴重,光衰實際測試時間為2000Hr,之後為推算的光衰幅度,而以LM70為本實驗的標準,同時也測試加速壽命實驗可以了解此材料的信賴度。 【關鍵詞彙】:LED、導熱材、散熱材、光衰、溫度

關鍵字

LED 導熱材 散熱材 光衰 溫度

並列摘要


In this thesis, thermal conductive material effects to temperatures and temperature transmitting analysis between LEDs and heat sinks is discussed. LEDs were packed multi chips in individual LED leader frames. The LED chips are concentrated-packed in the center of LED leader frame. It results the heat occurred by LED chips are not able to transfer into the efficient surface area of a heat sink. Due to figure out the relationships between LEDs and the heat sinks. LEDs are adapted into 2 groups. 1. LEDs are carried with heat sink. 2. LEDs are not carried with heat sink. How can a small contacted surface conduct heat effectively? 4 various of thermal conductive materials are utilized in our experiments. In order to consider the match up of mechanism between the surface of LED and heat sink, and the influence of heat versus illluminance. 4 different thermal conductive materials performed their advantages respectively in varied application of products. 3W 6W, and 9W of LEDs are chosen to test in this thesis. 3W and 9W of LEDs are able to make the significant differences in the comparison. 6W LEDs are the standard LED testing samples. According to the different thermal conductive materials, the measurements of temperatures, illuminance decay, and accelerated life test are recorded and discuss in this thesis. Thermal conductive glue, thermal-cured conductive glue, aluminum glue, and thermal conductive pad are applied to conduct the heat from LEDs to the heat sinks. The temperature differences of the knuckle points and the farthest points in the leader frame are measured to compare if the heat that occurred by LEDs is transferred successfully. Lager temperature differences resorted worse thermal conductivities. Higher illuminant depreciation will also be presented. During 2,000 hours of life testing, life time of LED’s application could be calculated based on LM70 testing standard. At the mean while, the reliability of the materials is accorded the measurements of accelerated life tests. 【Key word】:LED、Heat conduction material、Heat sink、Light Decay、Temperature

參考文獻


[8]游慧茹,璦司柏電子股份有限公司, LED散熱基板的趨勢
[10]研發處協理余河潔與應用工程師游慧茹,璦司柏電子股份有限公司
[11]導熱材料,寬憶電子股份有限公司
[1]鄭景太,出處-工業材料雜誌256期
[2]亞東投顧整理,LED散熱基板發展趨勢

被引用紀錄


黃文良(2013)。分離式綠能LED照明球泡燈〔碩士論文,國立虎尾科技大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0028-1908201314044800

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