新穎塑料USB LED 迷你球泡燈設計與優化

Design and Optimization of Novel USB Mini LED Bulb

黃文昱(Wen-Yu Huang)

指導教授 ： 陳文瑞

國立虎尾科技大學/電機資訊學院/電子工程系碩士班/碩士(2014年)

摘要

本論文係以低成本之Acrylonitrile Butadiene Styrene (ABS)塑料，做為節能LED固態照明球泡燈的燈具機構，以取代傳統金屬外殼散熱機構，本文以公規USB接頭取代傳統E27接頭，採電熱分離的概念，以避免電源轉換過程的熱累積於球泡燈內部，免除因電路損壞而造成球泡燈失效問題。另本研究以有限元素分析軟體，模擬球泡燈的熱傳導趨勢，使用直接敷銅設計作為載板高速熱傳導層，可提升熱流水平方向的加速傳導，優化Chip-On-Board(COB)封裝於陶瓷基板，研究發現陶瓷氮化鋁基板與MCPCB金屬基板模擬接面溫度表現有17%~22%的落差，然而內嵌金屬銅片於ABS塑料中，銅片體積僅5.584 cm3，金屬用量約為傳統式LED燈具的5%，甚至更低，實測極限功率約5W，穩態流明值為109 lm，ABS具輕巧、絕緣及可回收等優勢，定位於中低功率LED燈具、裝飾燈具，材料成本僅市售傳統LED燈具的30%，具有市場競爭力。

關鍵字

LED球泡燈 ； ABS塑料 ； LED燈具 ； COB封裝 ； 模擬

並列摘要

This paper is the use of low-cost Acrylonitrile Butadiene Styrene (ABS) plastic. design energy saving LED solid-state lighting bulb lamp bodies. replacing traditional metal cooling bodies. This study used a standard USB port to replace the traditional E27 connector. using the concept of the separation of electricity and heat. avoid heat accumulation in the power conversion process inside the bulb. not because of circuit damage caused bulb failures. This study used finite element analysis software to simulate the heat conduction trend of LED bulb. the use copper design high-speed heat conduction layer of carrier board . Enhance heat conduction horizontal acceleration. optimization of Chip-On-Board (COB) packaged in a ceramic substrate. The study found an aluminum nitride ceramic Substrate and MCPCB metal substrate analog junction temperature performance has 17% to 22% difference. However, copper metal embedded in ABS plastic, copper volume is only 5.584 cm3, the amount of metal is about 5 % use of traditional LED lamps, or even lower. the actual measurement limit power is 5W. lumen 109 is the steady state. ABS has a lightweight, non-conductive and advantages recyclable, set at low power LED lamps and decorative lamps. material cost only 30% of traditional LED lamps, with market competitiveness.

並列關鍵字

LED blub ； ABS plastic ； LED lamp ； COB pack ； Simulation

參考文獻

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