透過您的圖書館登入
IP:216.73.216.100
  • 學位論文

單軸多自由度量測系統設計開發之研究

The Development of a Multi-Degrees-of-Freedom Measurement System for the Single-Axis

指導教授 : 卓信鴻
共同指導教授 : 覺文郁(Wen-Yuh Jywe 覺文郁)
若您是本文的作者,可授權文章由華藝線上圖書館中協助推廣。

摘要


線性位移平台在目前精密設備產業中扮演相當重要之角色,隨著對高精度設備需求不斷地增長,與對加工精度要求不斷地提昇,線性位移平台的檢測技術已經被視為量測設備開發的重要課題。線性位移平台的誤差大多來自於組裝過程與元件品質。本研究以準直雷射、位置感測器、多個鏡組所組成,檢測多自由度誤差與平台組裝元件品質之技術為目標,開發具有高精度、高效率與低成本特性之檢測系統。 本研究主要針對線性位移平台運動時所產生之多自由度誤差,建構高精度之單軸多自由度量測系統。該系統可應用於線性滑軌、三次元量床、工具機、高精密度X-Y平台等線性運動誤差檢測與分析,並在廠商現場實測與驗證,量測距離可達2米,水平直度誤差範圍與垂直直度誤差範圍可量測±50μm,俯仰度誤差範圍與搖擺度誤差範圍可量得±50 Arc Sec,滾動度誤差範圍可量得±80 Arc Sec。直度度精度為1μm,角度精度為0.2 Arc Sec。

並列摘要


In recent years, the linear moving stage is a main part of the high precise equipment. Because of the increasing requirement of precise equipment and the improvement of the manufacturing precision, the research of measurement systems for linear moving stages has become a main task. The errors of multi-degree-of-freedom for linear moving stages are always caused by the assembling process and component qualities. Thus, the researches based on the errors of multi-degree-of-freedom and on the measurement of component quality are developed at the objectives of high accuracy, high efficiency and low cost. In the study, the measuring system based on multi-degree-of-freedom errors measurement for the linear moving component has been proposed. The proposed system can be applied for measuring linear motion errors of linear guideways, CMM, machine tools, high precision X-Y stage and etc. in the future. Measurement results showed that the residual error for the horizontal straightness, vertical straightness, pitch, yaw and roll is ±50μm, ±50μm,±50 Arc Sec, ±50 Arc Sec and ±80 Arc Sec respectively. The accuracy for the straightness and angular measurement is 1μm and 0.2 Arc Sec respectively.

參考文獻


[18]廖柏勛,“具即時波長補償與雙角度量測麥克森干涉儀之研製”,台灣大學,機械工程學研究所,2012
[19]王綜漢,“工具機阿貝誤差補償器的研究”,台灣大學,機械工程學研究所,2011。
[2]Sommargren, G. E., “Linear/angular Displacement Interferometer for Wafer Stage Metrology,” Proc. SPIE, Vol. 1088, pp.268-272, 1989.
[3]Nakamura, M. Goto, “Microscopic Coordinate Measurement by Four-beam Laser Interferometry,” Int. J. Japan Soc. Prec. Eng., Vol . 59, pp.155-160, 1993.
[4]W. Lee, and S. W. Kim, “An Ultraprecision Stage for Alignment of Wafers in Advanced Microlithography,” Prec. Eng., Vol. 21, pp.113-122, 1997.

延伸閱讀