本研究提出以大面積反射量測方式,結合CCD光強度影像分析技術來量測出待測物之表面輪廓。由於在量測方面為了能夠節省時間,以及能夠迅速瞭解整個待測物的面貌,所以對於非穿透之待測物而言,大面積量測是必要的。當一經擴束後之平行光投射在待測物上後,表面上的高度落差會造成反射光角度的改變,再經由平行四邊形稜鏡形成靈敏的出射光強度變化。因此可以很清楚的看出,待測物的表面上高度變化跟投射在平行四邊形稜鏡的入射角度變化是成正比關係,而入射角度變化又跟平行四邊形稜鏡之反射率變化也成正比,所以最後就可以利用CCD所擷取到的光強度變化來分析表面的形貌。此量測方式可以立即得到表面輪廓,從CCD即時的影像擷取,進而轉成三維表面形貌,從中可以馬上得到我們想要的資訊,這除了可以節省時間成本外,組裝容易、精確度也相對提高。
In this paper, we introduce a reflection-type profilometer which is a novel technique for measuring the large surface profile of a test plate using a CCD a array. In order to save time and rapidly observe the whole profile, therefore, large area measurement is necessary for non-transparent sample.When an expanded beam is normally incident on the test surface, the surface heights will change the directions of the reflection rays. Then the rays are incident into a parallelogram prism at the critical angle nearby, and the reflectance pattern of the output beam is proportional to the surface profile. We used a CCD array at the image plane to capture the reflectance pattern, and used these data and a personal computer to calculate the 3D image profile. This method also could be used to measure the surface defects and roughness at the same time. It is very easy and fast for the industrial application in 3D measurements.