對個案公司來說,記憶體模組曾經是其主力產品,但近年來該項產品的銷售額卻逐漸下降,以致影響個案公司的營收。由於記憶體模組產品所處的是高度競爭的市場,產品的毛利率低,所以,記憶體模組的製造業者無不想盡辦法改善其產品的生產良率及績效,以提升其產品及公司的競爭力。個案公司為了提升其記憶體模組產品的競爭力,迫切需要尋求一個有效的方法以改善此產品的生產績效及品質水準。 在記憶體模組產品的生產流程中,表面黏著技術(Surface Mount Technology, SMT)的應用是最關鍵的製程,其焊接品質的優劣,將直接影響記憶體模組產品的生產品質。因此,若於記憶體模組產品的生產流程中,未為表面黏著技術製程建立良好的管制系統及生產中的監控機制的話,表面黏著技術製程中的任何異常現象都會造成重工或修補生產成本的提升。有鑑於此,本研究以表面黏著技術製程為研究對象,並以失效模式與效應分析(Failure Mode and Effect Analysis, FMEA)為研究工具,嘗試藉此為表面黏著技術製程建立一個完善的製程監控以及預防問題發生的機制,並提升表面黏著技術製程及記憶體模組產品的生產績效及品質水準。 經過失效模式與效應分析的應用後,本研究除了將表面黏著技術製程中可能發生的失效模式一一辨認出來,也為這些失效模式依其重要性排序,並提出相對應的處理方式。根據本研究所得到的結果,個案公司於進行表面黏著技術製程前,可以有效的防止各種失效模式的發生,或者於進行表面黏著技術製程時,即使發生失效模式的問題,也可以事先擬定好的處理方式,將這些問題迅速解決。
For the case company, memory module was once its main product; however, in recent years, the sale of memory module keeps declining which affects the operating performance of the case company. Since the market of the memory module products is highly competitive and the gross profit is very low, hence, memory module manufacturers all try to reduce the defect rate and improve the production performance of their products in order to enhance the competitiveness of their products and companies. In order to improve the competitiveness of its memory module, the case company is eager to explore an effective resolution to improve the production performance and the quality level of this specific product. In the production process of the memory module products, the application of surface mount technology (SMT) is the most critical process; the quality of the welding operation directly affects the production quality of the memory module products. Therefore, if there is no well established control mechanism for the SMT process, any unusual phenomena can cause heavy rework or repair costs. For this reason, this research selects the SMT process as the studying subject and uses the failure mode and effects analysis (FMEA) as the research tool. This research tries to establish a comprehensive process control and problem prevention mechanism for the SMT process and enhance the production performance of the SMT process and the memory module products. After the failure mode and effects analysis applications, in this study, in addition to recognize all the failure modes of the SMT process, the importance of these failure modes are prioritized, and the corresponding resolution of each failure mode is also suggested. According to the results obtained in this study, the cases company can effectively prevent the occurrence of these failure modes before the SMT process begins or if any of the failure modes arises during the SMT process, it can be resolved promptly by applying the resolution formulated in advance.